Intel_AGFC023R24C2I2V
Intel_AGFC023R24C2I2V
original

Intel
AGFC023R24C2I2V

777-AGFC023R24C2I2V
IC
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
-40°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
480
Peripherals
DMA, WDT
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AGFC023R24C2I2V Description

AGFC023R24C2I2V Description

The AGFC023R24C2I2V is a high-performance System on Chip (SoC) from Intel's Agilex F series, designed to meet the demanding requirements of modern embedded systems. This SoC integrates a 1.4GHz processor with a versatile architecture that combines a Micro-Processing Unit (MPU) and Field-Programmable Gate Array (FPGA) capabilities. It offers a robust set of features, including 256KB of RAM, 480 I/O ports, and essential peripherals such as DMA and WDT. The AGFC023R24C2I2V supports a wide range of connectivity options, including EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, making it suitable for various applications. Packaged in a tray format, this SoC is currently in an active product status, ensuring continued availability and support.

AGFC023R24C2I2V Features

Technical Specifications

  • Speed: 1.4GHz, ensuring high-speed processing capabilities.
  • Architecture: MPU and FPGA, providing a flexible and powerful processing environment.
  • RAM Size: 256KB, offering ample memory for efficient data handling.
  • Number of I/O: 480, supporting extensive connectivity and peripheral integration.
  • Peripherals: DMA and WDT, enhancing system performance and reliability.
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG, providing comprehensive interface options.
  • Package: Tray, ensuring secure and reliable handling during manufacturing and assembly.

Performance Benefits

The AGFC023R24C2I2V stands out for its ability to handle complex tasks with ease, thanks to its 1.4GHz processing speed and integrated MPU and FPGA architecture. The MPU ensures efficient execution of high-level tasks, while the FPGA allows for customizable hardware acceleration, making it ideal for applications requiring both general-purpose processing and specialized functions. The 256KB of RAM ensures smooth data handling, while the extensive I/O capabilities support a wide range of peripherals and interfaces.

Unique Features

  • Versatile Architecture: Combining MPU and FPGA capabilities, the AGFC023R24C2I2V offers unparalleled flexibility and performance.
  • Extensive Connectivity: With support for multiple communication protocols, this SoC can seamlessly integrate into various systems and networks.
  • Robust Peripherals: DMA and WDT enhance system performance and reliability, ensuring stable operation even under demanding conditions.

AGFC023R24C2I2V Applications

The AGFC023R24C2I2V is ideal for a wide range of applications, including but not limited to:

  • Industrial Automation: Its high-speed processing and extensive I/O capabilities make it suitable for controlling complex machinery and processes.
  • Embedded Systems: The SoC's versatile architecture and comprehensive connectivity options make it a perfect fit for developing advanced embedded systems.
  • Networking: With Ethernet and USB OTG support, the AGFC023R24C2I2V can be used in networking devices, such as routers and switches.
  • Consumer Electronics: The SoC's capabilities can be leveraged in smart devices, providing high performance and connectivity.

Conclusion of AGFC023R24C2I2V

The AGFC023R24C2I2V is a powerful and versatile SoC from Intel's Agilex F series, offering a unique combination of MPU and FPGA capabilities, extensive connectivity options, and robust peripherals. Its 1.4GHz processing speed and 256KB of RAM ensure high performance and efficient data handling. With its active product status and tray packaging, the AGFC023R24C2I2V is an excellent choice for developers and engineers looking to build reliable and high-performance embedded systems. Whether used in industrial automation, networking, or consumer electronics, the AGFC023R24C2I2V provides a reliable and efficient solution.

FAQ

What package or case is AGFC023R24C2I2V available in?
AGFC023R24C2I2V is available in the 2340-BFBGA Exposed Pad package / case.
Are there related or alternative parts for AGFC023R24C2I2V?
What is AGFC023R24C2I2V?
Is AGFC023R24C2I2V currently in stock?
What operating temperature range does AGFC023R24C2I2V support?
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