Intel_AGFC023R25A2E1V
Intel_AGFC023R25A2E1V
original

Intel
AGFC023R25A2E1V

777-AGFC023R25A2E1V
IC FPGA AGILEX-F 2581FBGA
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
0°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
480
Peripherals
DMA, WDT
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AGFC023R25A2E1V Description

AGFC023R25A2E1V Description

The AGFC023R25A2E1V is an advanced Embedded IC Chip from Intel's Agilex F series, designed to deliver high performance and flexibility in a compact form factor. This IC FPGA features a 1.4GHz operating speed and a robust architecture that combines a Microprocessor Unit (MPU) with Field-Programmable Gate Array (FPGA) capabilities. It is engineered to operate within a temperature range of 0°C to 100°C (TJ), making it suitable for a wide range of industrial and embedded applications.

AGFC023R25A2E1V Features

  • High-Speed Performance: The AGFC023R25A2E1V operates at a speed of 1.4GHz, ensuring rapid processing capabilities and efficient data handling.
  • Robust Architecture: Combining MPU and FPGA, this IC offers a versatile platform for complex computing tasks and programmable logic applications.
  • Substantial RAM: With 256KB of RAM, the AGFC023R25A2E1V provides ample memory for data storage and processing, enhancing its performance in demanding applications.
  • Extensive I/O Connectivity: The IC features 480 I/O pins, supporting a wide array of peripherals and connectivity options, including DMA, WDT, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG.
  • Active Product Status: As an active product, the AGFC023R25A2E1V is supported by Intel with ongoing development and updates, ensuring long-term reliability and compatibility.
  • Moisture Sensitivity Level: With an MSL of 3 (168 Hours), the AGFC023R25A2E1V is designed to withstand environmental challenges, making it ideal for industrial and embedded environments.
  • Packaging: Available in a tray package, the AGFC023R25A2E1V is optimized for efficient handling and storage during manufacturing and assembly processes.

AGFC023R25A2E1V Applications

The AGFC023R25A2E1V is ideal for a variety of applications due to its high performance, flexibility, and extensive connectivity options. Key application areas include:

  • Industrial Automation: The robust architecture and wide temperature range make it suitable for controlling and monitoring industrial processes.
  • Embedded Systems: Its compact form factor and high-speed performance are ideal for embedded systems requiring efficient data processing and storage.
  • Networking: The extensive connectivity options, including Ethernet and USB OTG, make it a strong candidate for networking applications, such as routers and switches.
  • IoT Devices: The AGFC023R25A2E1V's programmable logic capabilities and extensive I/O options are well-suited for IoT devices that require flexibility and adaptability.
  • Medical Devices: The reliability and performance of the AGFC023R25A2E1V make it suitable for medical devices that require precise control and data processing.

Conclusion of AGFC023R25A2E1V

The AGFC023R25A2E1V is a versatile and high-performance Embedded IC Chip from Intel's Agilex F series. Its combination of MPU and FPGA architecture, along with its extensive connectivity options and robust performance, make it a standout choice for a variety of industrial and embedded applications. Whether used in industrial automation, networking, IoT devices, or medical equipment, the AGFC023R25A2E1V offers a reliable and efficient solution for demanding environments.

FAQ

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AGFC023R25A2E1V is available in the - package / case.
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