Intel_AGFC023R25A2E4F
Intel_AGFC023R25A2E4F
original

Intel
AGFC023R25A2E4F

777-AGFC023R25A2E4F
IC FPGA AGILEX-F 2581FBGA
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
0°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
480
Peripherals
DMA, WDT
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AGFC023R25A2E4F Description

AGFC023R52A2E4F Description

The AGFC023R25A2E4F is a high-performance System on Chip (SoC) developed by Intel, belonging to the Agilex F series. This IC FPGA is designed to deliver exceptional performance and versatility, making it suitable for a wide range of demanding applications. The device operates at a speed of 1.4GHz, ensuring rapid processing capabilities. It features a robust architecture that combines a Microprocessor Unit (MPU) and a Field Programmable Gate Array (FPGA), providing flexibility and adaptability for various computing tasks. The AGFC023R25A2E4F is equipped with 256KB of RAM, which is essential for efficient data handling and processing. It also supports a substantial number of I/Os, up to 480, allowing for extensive connectivity options. The operating temperature range of 0°C to 100°C (TJ) ensures reliable performance across a broad spectrum of environmental conditions. The product is currently active in the market, indicating its relevance and suitability for contemporary electronic systems.

AGFC023R25A2E4F Features

The AGFC023R25A2E4F boasts several key features that set it apart from similar models in the market. It integrates a variety of peripherals, including DMA (Direct Memory Access) and WDT (Watchdog Timer), which enhance its functionality and reliability. The connectivity options are extensive, encompassing EBI/EMI (External Bus Interface/External Memory Interface), Ethernet, I2C (Inter-Integrated Circuit), MMC/SD/SDIO (MultiMediaCard/Secure Digital/Secure Digital Input Output), SPI (Serial Peripheral Interface), UART/USART (Universal Asynchronous Receiver/Transmitter/Universal Synchronous/Asynchronous Receiver/Transmitter), and USB OTG (On-The-Go). These connectivity options make it highly versatile for interfacing with various peripherals and systems. The device is packaged in a 2581FBGA (Flip Chip Ball Grid Array) format, which is known for its high-density and high-performance characteristics. Additionally, the AGFC023R25A2E4F has a Moisture Sensitivity Level (MSL) of 3, with a 168-hour exposure time, ensuring it can withstand typical manufacturing processes without degradation.

AGFC023R25A2E4F Applications

The AGFC023R25A2E4F is ideal for applications that require high computational power, extensive connectivity, and robust performance. Its architecture and features make it suitable for advanced embedded systems, such as industrial automation, where real-time processing and control are critical. It is also well-suited for communication systems, including 5G infrastructure, where high-speed data processing and low-latency performance are essential. The device can be used in automotive applications, particularly in advanced driver-assistance systems (ADAS) and in-vehicle infotainment (IVI) systems, where reliability and performance are paramount. Additionally, the AGFC023R25A2E4F can be employed in IoT (Internet of Things) gateways, enabling seamless data aggregation and processing from multiple sensors and devices. Its extensive I/O capabilities and connectivity options make it a versatile choice for a wide range of applications, from simple control systems to complex, multi-functional devices.

Conclusion of AGFC023R25A2E4F

In conclusion, the AGFC023R25A2E4F is a powerful and versatile System on Chip (SoC) that offers a combination of high performance, extensive connectivity, and robust features. Its 1.4GHz processing speed, MPU and FPGA architecture, and 256KB of RAM make it capable of handling complex tasks efficiently. The wide range of peripherals and connectivity options, including Ethernet, I2C, and USB OTG, ensure it can be integrated into various systems with ease. The AGFC023R25A2E4F's operating temperature range and moisture sensitivity level further enhance its reliability and suitability for diverse environments. Whether used in industrial automation, communication systems, automotive applications, or IoT gateways, the AGFC023R25A2E4F stands out as a reliable and high-performance solution, making it a preferred choice for engineers and designers in the electronics industry.

FAQ

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The standard lead time for AGFC023R25A2E4F is 12 Weeks.
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