Intel

AGFC023R31C2E1VB

AGFC023R31C2E1VB Description

The AGFC023R31C2E1VB is a high-performance System on Chip (SoC) from Intel's Agilex F series, designed to meet the demanding requirements of modern electronics applications. This IC FPGA features a robust architecture combining a 1.4GHz MPU with an FPGA, offering versatile processing capabilities. The device operates within a temperature range of 0°C to 100°C (TJ), making it suitable for a wide range of industrial and commercial environments. With 256KB of RAM and 480 I/Os, the AGFC023R31C2E1VB provides ample memory and connectivity options. It also includes essential peripherals such as DMA and WDT, enhancing its functionality and reliability. The package type is Tray, ensuring easy integration into various systems.

AGFC023R31C2E1VB Features

Technical Specifications

• Speed: 1.4GHz
• Operating Temperature: 0°C to 100°C (TJ)
• Architecture: MPU, FPGA
• RAM Size: 256KB
• Number of I/O: 480
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Package: Tray
• Product Status: Active
• Series: Agilex F
• Manufacturer: Intel

Performance Benefits

The AGFC023R31C2E1VB stands out due to its high-speed processing capabilities, thanks to its 1.4GHz MPU. This speed ensures efficient handling of complex tasks, making it ideal for applications requiring real-time processing and high throughput. The combination of MPU and FPGA architecture provides a flexible and powerful platform, allowing for both general-purpose processing and specialized, programmable logic tasks.

The 256KB of RAM and 480 I/Os offer significant memory and connectivity options, enabling the device to manage large datasets and interface with numerous peripherals. This makes it suitable for applications requiring extensive data processing and communication capabilities.

Unique Features

The AGFC023R31C2E1VB includes a comprehensive set of peripherals, such as DMA and WDT, which enhance its functionality and reliability. The wide range of connectivity options, including EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, ensures seamless integration with various systems and devices. This versatility sets it apart from similar models, making it a preferred choice for designers and engineers.

AGFC023R31C2E1VB Applications

The AGFC023R31C2E1VB is ideal for a variety of applications due to its robust performance and versatile features. Some specific use cases include:

• Industrial Automation: The device's high-speed processing and extensive connectivity options make it suitable for controlling complex industrial processes and machinery.
• Telecommunications: Its ability to handle large data volumes and real-time processing makes it ideal for applications such as base stations and network routers.
• Automotive Systems: The AGFC023R31C2E1VB can be used in advanced driver-assistance systems (ADAS) and infotainment systems, where reliability and high performance are crucial.
• Medical Devices: The device's robust architecture and wide operating temperature range make it suitable for medical imaging and diagnostic equipment.

Conclusion of AGFC023R31C2E1VB

The AGFC023R31C2E1VB is a powerful and versatile System on Chip (SoC) from Intel's Agilex F series, offering high-speed processing, extensive memory, and a wide range of connectivity options. Its unique combination of MPU and FPGA architecture, along with essential peripherals, makes it a reliable and efficient choice for various applications. Whether used in industrial automation, telecommunications, automotive systems, or medical devices, the AGFC023R31C2E1VB delivers exceptional performance and reliability, making it a standout product in the electronics industry.