Intel_AGFD019R25A2E3E
Intel_AGFD019R25A2E3E
original

Intel
AGFD019R25A2E3E

777-AGFD019R25A2E3E
IC FPGA AGILEX-F 2581FBGA
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
0°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
480
Peripherals
DMA, WDT
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AGFD019R25A2E3E Description

AGFD019R25A2E3E Description

The AGFD019R25A2E3E is a high-performance System on Chip (SoC) from Intel's Agilex F series, designed to deliver exceptional processing capabilities and versatility for a wide range of applications. This IC FPGA features a 1.4GHz processing speed, ensuring rapid data handling and efficient execution of complex tasks. It operates within a temperature range of 0°C to 100°C (TJ), making it suitable for both standard and high-temperature environments. The architecture combines a Microprocessor Unit (MPU) and Field-Programmable Gate Array (FPGA), offering flexibility and programmability to meet diverse application requirements.

With 256KB of RAM, the AGFD019R25A2E3E provides ample memory for data storage and processing, while its 480 I/O ports enable extensive connectivity options. The device is equipped with essential peripherals such as Direct Memory Access (DMA) and Watchdog Timer (WDT), enhancing its functionality and reliability. The product is currently active, ensuring availability and support for ongoing projects.

AGFD019R25A2E3E Features

The AGFD019R25A2E3E stands out with its advanced connectivity options, including EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, facilitating seamless integration with various peripherals and systems. Packaged in a tray format with a Moisture Sensitivity Level (MSL) of 3 (168 Hours), it is designed for robustness and ease of handling during manufacturing processes.

Key features include:

  • High-Speed Processing: 1.4GHz MPU and FPGA architecture ensures fast and efficient data processing.
  • Wide Operating Temperature Range: Suitable for applications in varying environmental conditions.
  • Flexible Memory and I/O: 256KB RAM and 480 I/O ports provide ample resources for complex tasks.
  • Enhanced Peripherals: Integrated DMA and WDT improve system functionality and reliability.
  • Robust Connectivity: Multiple interface options enable versatile integration with other systems.
  • Active Product Status: Ensures ongoing support and availability for current and future projects.

AGFD019R25A2E3E Applications

The AGFD019R25A2E3E is ideal for applications requiring high performance and flexibility. Its combination of MPU and FPGA architecture makes it suitable for:

  • Embedded Systems: Ideal for developing intelligent embedded systems that require real-time processing and programmability.
  • Industrial Automation: Provides the necessary processing power and connectivity for controlling and monitoring industrial processes.
  • Communication Systems: Supports high-speed data transmission and interfacing with various communication protocols.
  • Consumer Electronics: Enables the development of advanced consumer devices with enhanced functionality and performance.
  • Automotive Systems: Suitable for automotive applications requiring robust performance and reliability.

Conclusion of AGFD019R25A2E3E

The AGFD019R25A2E3E is a versatile and high-performance SoC that offers significant advantages over similar models. Its combination of MPU and FPGA architecture, extensive connectivity options, and robust operating temperature range make it a reliable choice for a wide range of applications. Whether used in embedded systems, industrial automation, or consumer electronics, the AGFD019R25A2E3E delivers exceptional performance and flexibility, ensuring it remains a valuable component in modern electronic designs.

FAQ

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