Intel

AGFD019R25A2E4X

AGFD019R25A2E4X Description

The AGFD019R25A2E4X is a high-performance System on Chip (SoC) from Intel's Agilex F series, designed to meet the demanding requirements of modern embedded systems and IoT applications. This SoC integrates a powerful 1.4GHz MPU and FPGA architecture, offering a robust combination of processing power and programmable flexibility. With a RAM size of 256KB and 480 I/Os, it provides ample memory and connectivity options for a wide range of applications.

The AGFD019R25A2E4X operates within a temperature range of 0°C to 100°C (TJ), making it suitable for both industrial and consumer environments. It features a comprehensive set of peripherals, including DMA and WDT, enhancing its functionality and reliability. The SoC supports various connectivity options such as EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, ensuring seamless integration with other devices and systems.

Packaged in a 2581FBGA format and available in a tray, the AGFD019R25A2E4X has a moisture sensitivity level (MSL) of 3, allowing for 168 hours of exposure before assembly. This product is currently active, ensuring continued support and availability for ongoing projects.

AGFD019R25A2E4X Features

• High-Speed Processing: The 1.4GHz MPU and FPGA architecture deliver exceptional performance, making it ideal for applications requiring real-time processing and complex computations.
• Robust Memory and I/O: With 256KB of RAM and 480 I/Os, the AGFD019R25A2E4X offers ample resources for handling large data sets and interfacing with multiple peripherals.
• Wide Operating Temperature Range: Suitable for use in environments ranging from 0°C to 100°C (TJ), this SoC is well-suited for both industrial and consumer applications.
• Comprehensive Peripheral Set: Features DMA and WDT, enhancing system functionality and reliability.
• Versatile Connectivity Options: Supports EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, ensuring seamless integration with a variety of external devices.
• Reliable Packaging: The 2581FBGA package and tray format, combined with an MSL of 3, ensure robustness and ease of assembly.

AGFD019R25A2E4X Applications

The AGFD019R25A2E4X is ideal for a wide range of applications, including:

• Industrial Automation: Its robust performance and wide operating temperature range make it suitable for controlling complex machinery and systems in industrial environments.
• Internet of Things (IoT): The SoC's programmable flexibility and extensive connectivity options enable it to serve as a central hub for IoT devices, managing data collection, processing, and communication.
• Embedded Systems: The combination of MPU and FPGA architecture provides a powerful platform for developing custom embedded solutions, from consumer electronics to specialized industrial equipment.
• Telecommunications: The AGFD019R25A2E4X can be used in networking equipment, where its high-speed processing and connectivity options are crucial for managing data traffic and ensuring reliable communication.

Conclusion of AGFD019R25A2E4X

The AGFD019R25A2E4X is a versatile and powerful SoC that stands out in its class due to its high-speed processing capabilities, robust memory and I/O options, and extensive connectivity features. Its wide operating temperature range and reliable packaging make it suitable for a variety of applications, from industrial automation to IoT and embedded systems. The comprehensive set of peripherals and connectivity options ensures seamless integration with other devices, making it an ideal choice for developers looking to create efficient and reliable systems. With its active product status and ongoing support from Intel, the AGFD019R25A2E4X is a future-proof solution for modern electronics applications.