Intel_AGFD019R25A2I2V
Intel_AGFD019R25A2I2V
original

Intel
AGFD019R25A2I2V

777-AGFD019R25A2I2V
IC FPGA AGILEX-F 2581FBGA
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
-40°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
480
Peripherals
DMA, WDT
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AGFD019R25A2I2V Description

AGFD019R25A2I2V Description

The AGFD019R25A2I2V is an advanced System on Chip (SoC) from Intel's Agilex F series, designed to deliver high performance and flexibility for a wide range of applications. This IC FPGA features a 1.4GHz processing speed, combining a Microprocessor Unit (MPU) and Field Programmable Gate Array (FPGA) architecture. It is equipped with 256KB of RAM and offers a robust set of 480 I/O connections, making it highly versatile for complex system designs. The AGFD019R25A2I2V also includes essential peripherals such as DMA (Direct Memory Access) and WDT (Watchdog Timer), ensuring efficient data handling and system reliability.

AGFD019R25A2I2V Features

  • High-Speed Processing: With a clock speed of 1.4GHz, the AGFD019R25A2I2V ensures rapid data processing and execution of complex tasks.
  • Dual Architecture: The combination of MPU and FPGA architecture provides both high-level processing capabilities and the flexibility to customize hardware logic.
  • Substantial RAM: 256KB of RAM allows for efficient data storage and retrieval, supporting multiple concurrent operations.
  • Extensive I/O Connectivity: The 480 I/O connections offer ample flexibility for interfacing with various peripherals and external devices.
  • Peripheral Integration: Integrated DMA and WDT peripherals enhance data transfer efficiency and system stability.
  • Active Product Status: The AGFD019R25A2I2V is an active product, ensuring continued support and availability for ongoing projects.
  • Advanced Connectivity Options: The SoC supports a wide range of connectivity options including EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, facilitating seamless integration into modern systems.
  • Moisture Sensitivity Level: MSL 3 (168 Hours) ensures the device is suitable for a variety of manufacturing environments, reducing the risk of moisture-related damage.

AGFD019R25A2I2V Applications

The AGFD019R25A2I2V is ideal for applications requiring high performance, flexibility, and robust connectivity. Its advanced features make it suitable for:

  • Embedded Systems: Ideal for developing complex embedded systems that require high processing power and customizable hardware logic.
  • Industrial Automation: The extensive I/O and connectivity options make it well-suited for industrial control systems and automation applications.
  • Networking Equipment: The support for Ethernet and USB OTG connectivity makes it a strong candidate for networking devices and communication infrastructure.
  • Consumer Electronics: The AGFD019R25A2I2V can be used in consumer electronics where high-speed processing and versatile connectivity are required.
  • Automotive Systems: The combination of MPU and FPGA architecture provides the flexibility needed for advanced automotive systems, including infotainment and control units.

Conclusion of AGFD019R25A2I2V

The AGFD019R25A2I2V from Intel's Agilex F series is a powerful and versatile System on Chip (SoC) that offers a unique blend of high-speed processing, customizable hardware logic, and extensive connectivity options. Its 1.4GHz processing speed, MPU and FPGA architecture, and 256KB of RAM make it an excellent choice for applications ranging from embedded systems to industrial automation. The inclusion of essential peripherals like DMA and WDT further enhances its reliability and efficiency. With its active product status and moisture sensitivity level of MSL 3 (168 Hours), the AGFD019R25A2I2V is a reliable and future-proof solution for modern electronics design.

FAQ

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