Intel_AGFD019R31C2I1VB
Intel_AGFD019R31C2I1VB
original

Intel
AGFD019R31C2I1VB

777-AGFD019R31C2I1VB
IC FPGA AGILEX-F 3184BGA
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
-40°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
480
Peripherals
DMA, WDT
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AGFD019R31C2I1VB Description

AGFD019R31C2I1VB Description

The AGFD019R31C2I1VB is an advanced Embedded IC Chip from Intel's Agilex F series, designed to deliver exceptional performance and flexibility for a wide range of applications. This IC features a 1.4GHz operating speed, leveraging a dual-architecture of MPU and FPGA to provide robust processing capabilities. With 256KB of RAM and 480 I/O ports, it offers ample memory and connectivity options. The AGFD019R31C2I1VB also includes essential peripherals such as DMA and WDT, ensuring efficient data management and system reliability. The product is currently active, indicating its readiness for deployment in various embedded systems.

AGFD019R31C2I1VB Features

  • High-Speed Performance: The AGFD019R31C2I1VB operates at a speed of 1.4GHz, ensuring rapid processing and execution of complex tasks.
  • Dual Architecture: Combining MPU and FPGA, this chip offers both high-performance processing and programmable logic capabilities, making it versatile for diverse applications.
  • Memory and I/O: With 256KB of RAM and 480 I/O ports, the AGFD019R31C2I1VB provides substantial memory and extensive connectivity options, supporting large-scale data handling and interfacing with multiple devices.
  • Peripheral Integration: The inclusion of DMA and WDT peripherals enhances data transfer efficiency and system stability, reducing the need for external components.
  • Connectivity Options: The AGFD019R31C2I1VB supports a variety of connectivity protocols, including EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, facilitating seamless integration into modern embedded systems.
  • Packaging: The chip is available in a tray package, making it suitable for automated assembly processes and ensuring reliable handling during manufacturing.

AGFD019R31C2I1VB Applications

The AGFD019R31C2I1VB is ideal for applications requiring high-speed processing, extensive connectivity, and programmable logic. Its dual architecture makes it particularly suitable for:

  • Industrial Automation: Managing complex control systems and real-time data processing in manufacturing environments.
  • Telecommunications: Enabling efficient data handling and signal processing in communication infrastructure.
  • Automotive Systems: Supporting advanced driver-assistance systems (ADAS) and in-vehicle infotainment (IVI) systems.
  • Medical Devices: Facilitating real-time data processing and control in medical imaging and diagnostic equipment.
  • Consumer Electronics: Enhancing performance in smart home devices, gaming consoles, and multimedia systems.

Conclusion of AGFD019R31C2I1VB

The AGFD019R31C2I1VB from Intel's Agilex F series stands out as a powerful and versatile embedded IC chip. Its combination of high-speed processing, dual architecture, extensive memory and I/O capabilities, and integrated peripherals make it a standout choice for demanding applications. The wide range of connectivity options and robust packaging further enhance its suitability for modern embedded systems. Whether used in industrial automation, telecommunications, automotive systems, medical devices, or consumer electronics, the AGFD019R31C2I1VB delivers reliable performance and flexibility, setting it apart from similar models in the market.

FAQ

What package or case is AGFD019R31C2I1VB available in?
AGFD019R31C2I1VB is available in the 3184-BFBGA Exposed Pad package / case.
Is AGFD019R31C2I1VB currently in stock?
What is AGFD019R31C2I1VB?
What is the standard lead time for AGFD019R31C2I1VB?
What operating temperature range does AGFD019R31C2I1VB support?
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