Intel_AGFD019R31C2I3V
Intel_AGFD019R31C2I3V
original

Intel
AGFD019R31C2I3V

777-AGFD019R31C2I3V
IC FPGA AGILEX-F 3184FBGA
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
-40°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
480
Peripherals
DMA, WDT
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AGFD019R31C2I3V Description

AGFD019R31C2I3V Description

The AGFD019R31C2I3V is an advanced Embedded IC Chip belonging to the Agilex F series, manufactured by Intel. This IC is designed to deliver high performance and flexibility, making it ideal for a wide range of applications. It features a 1.4GHz speed, which ensures rapid processing capabilities, and is built on a MPU and FPGA architecture, providing robust computational power and programmability. The device includes 256KB of RAM, which is sufficient for handling complex tasks and data-intensive operations. With 480 I/O ports, the AGFD019R31C2I3V offers extensive connectivity options, enabling seamless integration with various peripheral devices and systems.

AGFD019R31C2I3V Features

The AGFD019R31C2I3V stands out due to its comprehensive set of features and capabilities. It includes a DMA (Direct Memory Access) controller, which allows for efficient data transfer between memory and peripherals without CPU intervention, thereby enhancing overall system performance. The inclusion of a WDT (Watchdog Timer) ensures system reliability by monitoring and resetting the device in case of software malfunctions or hangs.

The connectivity options are extensive, featuring EBI/EMI (External Bus Interface/External Memory Interface) for memory expansion, Ethernet for network connectivity, I2C for communication with low-speed peripherals, MMC/SD/SDIO for memory card interfacing, SPI for high-speed communication with peripherals, UART/USART for serial communication, and USB OTG for versatile connectivity with USB devices. The device is packaged in a 3184FBGA (Flip-Chip Ball Grid Array) format, which is housed in a tray, ensuring secure and reliable handling during manufacturing and assembly processes.

AGFD019R31C2I3V Applications

The AGFD019R31C2I3V is highly versatile and suitable for a variety of applications across different industries. Its high-speed processing and extensive I/O capabilities make it ideal for embedded systems that require real-time processing and control, such as industrial automation, robotics, and IoT (Internet of Things) devices. The robust architecture and programmability of the FPGA allow for customization and adaptation to specific application requirements, making it a preferred choice for developers and engineers working on complex projects.

In the automotive sector, the AGFD019R31C2I3V can be used for advanced driver-assistance systems (ADAS) and infotainment systems, where high performance and reliability are crucial. In telecommunications, it can be employed in base stations and network equipment for efficient data processing and communication. The device is also well-suited for consumer electronics, where its capabilities can enhance the performance of smart devices and appliances.

Conclusion of AGFD019R31C2I3V

The AGFD019R31C2I3V is a powerful and flexible Embedded IC Chip that offers a range of technical specifications and features tailored to meet the demands of modern embedded systems. Its high-speed processing, extensive connectivity options, and programmable architecture provide significant advantages over similar models, making it a standout choice for a variety of applications. Whether used in industrial automation, automotive systems, telecommunications, or consumer electronics, the AGFD019R31C2I3V delivers reliable performance and adaptability, ensuring it remains a key component in the electronics industry.

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