Intel_AGFD019R31C3I3E
Intel_AGFD019R31C3I3E
original

Intel
AGFD019R31C3I3E

777-AGFD019R31C3I3E
IC FPGA AGILEX-F 3184FBGA
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
-40°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
480
Peripherals
DMA, WDT
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AGFD019R31C3I3E Description

AGFD019R31C3I3E Description

The AGFD019R31C3I3E is a high-performance embedded IC chip from Intel's Agilex F series, designed for demanding applications requiring advanced processing capabilities and extensive connectivity options. This chip features a 1.4GHz processing speed, combining a MPU (MicroProcessing Unit) and FPGA (Field-Programmable Gate Array) architecture to deliver versatile and scalable performance. With 256KB of RAM and 480 I/O pins, it offers robust memory and extensive connectivity options. The AGFD019R31C3I3E also includes essential peripherals such as DMA (Direct Memory Access) and WDT (Watchdog Timer), ensuring efficient data handling and system reliability. Packaged in a 3184FBGA format and available in tray packaging, this product is ideal for applications requiring high-speed processing and extensive connectivity.

AGFD019R31C3I3E Features

  • High-Speed Processing: The AGFD019R31C3I3E operates at a speed of 1.4GHz, providing rapid processing capabilities suitable for real-time applications.
  • Dual Architecture: Combining MPU and FPGA, this chip offers the flexibility of programmable logic with the efficiency of a dedicated processor.
  • Robust Memory and Connectivity: With 256KB of RAM and 480 I/O pins, it supports complex applications requiring significant data handling and peripheral integration.
  • Advanced Peripherals: Features DMA and WDT, enhancing data transfer efficiency and system reliability.
  • Extensive Connectivity Options: Supports EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, making it suitable for a wide range of applications.
  • Active Product Status: Ensures continued support and availability for ongoing projects and future developments.
  • Series and Manufacturer: Part of Intel's Agilex F series, known for its innovation and performance in embedded systems.

AGFD019R31C3I3E Applications

The AGFD019R31C3I3E is ideal for applications requiring high-speed processing and extensive connectivity. Some specific use cases include:

  • Industrial Automation: Ideal for controlling complex machinery and processes, where real-time data processing and extensive I/O capabilities are crucial.
  • Telecommunications: Suitable for networking equipment, where high-speed data processing and connectivity options like Ethernet and USB OTG are essential.
  • Medical Devices: Can be used in medical imaging and diagnostic equipment, where reliable data handling and processing speed are paramount.
  • Automotive Systems: Applicable in advanced driver-assistance systems (ADAS) and infotainment systems, where high-speed processing and reliable connectivity are required.
  • Consumer Electronics: Perfect for smart home devices and IoT applications, where extensive connectivity and efficient data processing are necessary.

Conclusion of AGFD019R31C3I3E

The AGFD019R31C3I3E from Intel's Agilex F series is a powerful embedded IC chip designed to meet the demands of modern applications. Its combination of high-speed processing, dual architecture, robust memory, and extensive connectivity options make it a versatile solution for a wide range of industries. The inclusion of advanced peripherals like DMA and WDT further enhances its reliability and efficiency. Whether used in industrial automation, telecommunications, medical devices, automotive systems, or consumer electronics, the AGFD019R31C3I3E offers a reliable and high-performance solution. Its active product status ensures ongoing support and availability, making it a future-proof choice for embedded system developers.

FAQ

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The standard lead time for AGFD019R31C3I3E is 12 Weeks.
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