Intel_AGFD023R25A2I3V
Intel_AGFD023R25A2I3V
original

Intel
AGFD023R25A2I3V

777-AGFD023R25A2I3V
IC FPGA AGILEX-F 2581FBGA
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
-40°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
480
Peripherals
DMA, WDT
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AGFD023R25A2I3V Description

AGFD023R25A2I3V Description

The AGFD023R25A2I3V is an advanced System on Chip (SoC) from Intel's Agilex F series, designed to deliver high performance and flexibility in a compact form factor. This IC FPGA features a robust architecture combining a Micro-Processing Unit (MPU) and Field-Programmable Gate Array (FPGA) capabilities, making it ideal for complex embedded systems and high-speed processing applications. The device operates at a speed of 1.4GHz, ensuring rapid data processing and efficient execution of tasks. With 256KB of RAM, it provides ample memory for storing critical data and instructions, while its 480 I/O ports offer extensive connectivity options for interfacing with various peripherals and external devices.

AGFD023R25A2I3V Features

  • High-Speed Performance: The AGFD023R25A2I3V operates at a speed of 1.4GHz, enabling rapid data processing and efficient task execution.
  • Dual Architecture: Combining MPU and FPGA capabilities, this SoC offers the flexibility to handle both general-purpose processing and specialized, programmable logic tasks.
  • Robust Memory and I/O: Equipped with 256KB of RAM and 480 I/O ports, this device can manage large datasets and interface with numerous peripherals.
  • Advanced Peripherals: Features Direct Memory Access (DMA) and Watchdog Timer (WDT) for enhanced system performance and reliability.
  • Connectivity Options: Supports a wide range of connectivity options including EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, making it suitable for diverse applications.
  • Moisture Sensitivity Level (MSL): Rated at MSL 3 (168 Hours), ensuring durability and reliability in various environmental conditions.
  • Packaging: Available in a Tray package, facilitating easy integration into various electronic systems.

AGFD023R25A2I3V Applications

The AGFD023R25A2I3V is ideal for applications requiring high-speed processing and extensive connectivity. Its dual architecture makes it suitable for embedded systems where both general-purpose processing and specialized logic tasks are required. The extensive I/O capabilities and connectivity options make it perfect for applications in industrial automation, telecommunications, and high-performance computing. Specific use cases include:

  • Industrial Automation: For controlling complex machinery and systems, where real-time processing and reliable connectivity are crucial.
  • Telecommunications: In base stations and network equipment, where high-speed data processing and robust connectivity are essential.
  • High-Performance Computing: For applications requiring rapid data processing and efficient memory management, such as data centers and scientific computing.

Conclusion of AGFD023R25A2I3V

The AGFD023R25A2I3V is a versatile and powerful SoC that stands out in its category due to its high-speed performance, dual architecture, and extensive connectivity options. Its robust memory and I/O capabilities, combined with advanced peripherals, make it an ideal choice for a wide range of applications. Whether used in industrial automation, telecommunications, or high-performance computing, the AGFD023R25A2I3V offers significant advantages over similar models, ensuring reliable performance and efficient task execution.

FAQ

What operating temperature range does AGFD023R25A2I3V support?
AGFD023R25A2I3V has an operating temperature range of -40°C ~ 100°C (TJ).
What is AGFD023R25A2I3V?
Is AGFD023R25A2I3V currently in stock?
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