Intel

AGFD023R25A3I3E

AGFD023R25A3I3E Description

The AGFD023R25A3I3E is an advanced System on Chip (SoC) from Intel's Agilex F series, designed to deliver exceptional performance and flexibility for a wide range of applications. This IC FPGA features a 1.4GHz processing speed, powered by a combination of a Microprocessor Unit (MPU) and Field Programmable Gate Array (FPGA) architecture. With 256KB of RAM and 480 I/O ports, it offers robust data handling capabilities. The device is equipped with essential peripherals such as DMA (Direct Memory Access) and WDT (Watchdog Timer), ensuring efficient data management and system reliability.

The AGFD023R25A3I3E is housed in a 2581FBGA package, which is known for its high thermal performance and mechanical stability. It is moisture-sensitive at level 3, requiring a 168-hour bake time to ensure reliability in various environmental conditions. The product is currently active, indicating that it is a reliable choice for new and ongoing projects.

AGFD023R25A3I3E Features

• High-Speed Processing: The 1.4GHz speed ensures rapid execution of complex tasks, making it suitable for high-performance computing environments.
• Flexible Architecture: The MPU and FPGA architecture provides a balance between programmable logic and traditional microprocessing, offering unparalleled flexibility and scalability.
• Robust Memory and I/O: With 256KB of RAM and 480 I/O ports, the AGFD023R25A3I3E can handle large datasets and multiple peripheral connections efficiently.
• Comprehensive Connectivity Options: The device supports a wide range of connectivity options, including EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, making it versatile for various applications.
• Reliable Peripherals: Integrated DMA and WDT peripherals enhance data transfer efficiency and system reliability.
• Advanced Packaging: The 2581FBGA package ensures high thermal performance and mechanical stability, crucial for high-density applications.
• Moisture Sensitivity Level 3: The device can withstand moisture-sensitive environments with a 168-hour bake time, ensuring long-term reliability.

AGFD023R25A3I3E Applications

The AGFD023R25A3I3E is ideal for applications requiring high-speed processing, flexible architecture, and robust connectivity. Some specific use cases include:

• High-Performance Computing: The combination of MPU and FPGA architecture makes it suitable for applications requiring both high-speed processing and programmable logic.
• Embedded Systems: The extensive I/O capabilities and connectivity options make it ideal for embedded systems requiring multiple peripheral connections.
• Industrial Automation: The robustness and reliability of the device, along with its connectivity options, make it suitable for industrial automation applications.
• Telecommunications: The Ethernet and USB OTG connectivity options make it ideal for telecommunications applications requiring high-speed data transfer.
• Consumer Electronics: The versatile connectivity options and high-speed processing capabilities make it suitable for consumer electronics requiring advanced processing and connectivity.

Conclusion of AGFD023R25A3I3E

The AGFD023R25A3I3E from Intel's Agilex F series is a versatile and high-performance SoC that offers a unique blend of processing power, flexibility, and connectivity options. Its 1.4GHz speed, MPU and FPGA architecture, and extensive I/O capabilities make it suitable for a wide range of applications, from high-performance computing to industrial automation. The advanced packaging and moisture sensitivity level ensure long-term reliability, making it a reliable choice for new and ongoing projects.