Intel_AGFD023R31C3E3E
Intel_AGFD023R31C3E3E
original

Intel
AGFD023R31C3E3E

777-AGFD023R31C3E3E
IC FPGA AGILEX-F 3184FBGA
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
0°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
480
Peripherals
DMA, WDT
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AGFD023R31C3E3E Description

AGFD023R31C3E3E Description

The AGFD023R31C3E3E is an advanced System on Chip (SoC) from Intel's Agilex F series, designed to deliver high performance and flexibility in a compact form factor. This IC FPGA features a 1.4GHz processing speed, ensuring rapid data handling and execution of complex tasks. The operating temperature range of 0°C to 100°C (TJ) makes it suitable for a variety of environmental conditions, from industrial to consumer applications.

AGFD023R31C3E3E Features

  • High-Speed Processing: The AGFD023R31C3E3E boasts a 1.4GHz speed, enabling efficient and rapid processing capabilities.
  • Robust Architecture: It features a combination of a Microprocessor Unit (MPU) and Field Programmable Gate Array (FPGA), providing both programmable logic and high-performance processing.
  • Memory and I/O: Equipped with 256KB of RAM and 480 I/O pins, this SoC can handle substantial data storage and communication tasks.
  • Peripheral Support: Integrated peripherals such as DMA (Direct Memory Access) and WDT (Watchdog Timer) enhance its functionality and reliability.
  • Connectivity Options: The AGFD023R31C3E3E offers a wide range of connectivity options, including EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, making it highly versatile for various applications.
  • Packaging: Supplied in a 3184FBGA package and available in a tray, it is designed for easy integration into different systems.
  • Active Product Status: As an active product, it ensures long-term availability and support from Intel.

AGFD023R31C3E3E Applications

The AGFD023R31C3E3E is ideal for applications requiring high performance, flexibility, and robust connectivity. Its unique features make it suitable for:

  • Industrial Automation: The combination of high-speed processing and extensive I/O capabilities make it ideal for controlling and monitoring complex industrial processes.
  • Embedded Systems: Its compact size and high performance make it suitable for embedded systems in consumer electronics, automotive, and IoT devices.
  • Communication Systems: The wide range of connectivity options, including Ethernet and USB OTG, make it a strong candidate for communication and networking applications.
  • Medical Devices: The robust architecture and wide operating temperature range make it suitable for medical devices that require high reliability and performance.

Conclusion of AGFD023R31C3E3E

The AGFD023R31C3E3E from Intel's Agilex F series is a versatile and high-performance SoC that stands out in its category. Its unique combination of MPU and FPGA architecture, coupled with extensive connectivity options and robust I/O capabilities, makes it an excellent choice for a wide range of applications. Whether used in industrial automation, embedded systems, communication networks, or medical devices, the AGFD023R31C3E3E delivers performance reliable and flexibility, ensuring it remains a top choice for engineers and designers in the electronics industry.

FAQ

What package or case is AGFD023R31C3E3E available in?
AGFD023R31C3E3E is available in the 3184-BFBGA Exposed Pad package / case.
What operating temperature range does AGFD023R31C3E3E support?
What is the standard lead time for AGFD023R31C3E3E?
What is AGFD023R31C3E3E?
Are there related or alternative parts for AGFD023R31C3E3E?
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