Intel_AGFD023R31C3I3E
Intel_AGFD023R31C3I3E
original

Intel
AGFD023R31C3I3E

777-AGFD023R31C3I3E
IC FPGA AGILEX-F 3184FBGA
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
-40°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
480
Peripherals
DMA, WDT
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AGFD023R31C3I3E Description

AGFD023R31C3I3E Description

The AGFD023R31C3I3E is a high-performance Embedded IC Chip from Intel's Agilex F series, designed to meet the demanding requirements of modern embedded systems. This IC features a 1.4GHz processing speed, leveraging a dual-architecture design that combines a Micro-Processing Unit (MPU) with Field-Programmable Gate Array (FPGA) capabilities. The MPU provides robust processing power for complex tasks, while the FPGA offers flexibility for custom logic and parallel processing.

AGFD023R31C3I3E Features

The AGFD023R31C3I3E boasts a comprehensive set of features that make it an ideal choice for a wide range of applications. Key specifications include:

  • Speed: 1.4GHz, ensuring rapid processing capabilities.
  • Architecture: MPU and FPGA, offering a versatile combination of processing power and programmability.
  • RAM Size: 256KB, providing ample memory for data storage and processing.
  • Number of I/O: 480, supporting extensive connectivity options.
  • Peripherals: DMA (Direct Memory Access) and WDT (Watchdog Timer), enhancing system efficiency and reliability.
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, facilitating seamless integration with various peripherals and communication protocols.
  • Package: Tray, ensuring easy handling and integration into manufacturing processes.
  • Product Status: Active, indicating that the product is currently in production and supported by Intel.

AGFD023R31C3I3E Applications

The AGFD023R31C3I3E is well-suited for a variety of applications due to its robust performance and extensive connectivity options. Some ideal use cases include:

  • Industrial Automation: The combination of MPU and FPGA architectures allows for real-time control and data processing, making it ideal for industrial automation systems that require high precision and reliability.
  • Embedded Systems: The 256KB RAM and extensive I/O capabilities make it suitable for complex embedded systems, such as IoT gateways and smart sensors.
  • Telecommunications: The Ethernet and USB OTG connectivity options enable seamless integration into telecom infrastructure, supporting high-speed data transmission and network management.
  • Medical Devices: The DMA and WDT peripherals enhance system reliability, making it suitable for critical medical devices that require high uptime and data integrity.

Conclusion of AGFD023R31C3I3E

The AGFD023R31C3I3E from Intel's Agilex F series is a versatile and powerful Embedded IC Chip that offers a unique blend of processing power and programmability. Its 1.4GHz speed, combined with MPU and FPGA architectures, ensures high performance and flexibility. With 256KB of RAM and 480 I/O ports, it can handle complex tasks and extensive connectivity requirements. The inclusion of DMA and WDT peripherals further enhances its reliability and efficiency.

The AGFD023R31C3I3E is an excellent choice for applications in industrial automation, embedded systems, telecommunications, and medical devices. Its extensive connectivity options and active product status ensure that it remains a reliable and supported solution for modern electronic systems.

FAQ

What package or case is AGFD023R31C3I3E available in?
AGFD023R31C3I3E is available in the 3184-BFBGA Exposed Pad package / case.
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