Intel_AGIB023R18A1E2V
Intel_AGIB023R18A1E2V
original

Intel
AGIB023R18A1E2V

777-AGIB023R18A1E2V
IC FPGA AGILEX-I 1805FBGA
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
0°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
480
Peripherals
DMA, WDT
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AGIB023R18A1E2V Description

AGIB023R18A1E2V Description

The AGIB023R18A1E2V is a high-performance System on Chip (SoC) from Intel's Agilex I series, designed to meet the demanding requirements of modern embedded systems. This SoC integrates a 1.4GHz processing speed with a robust architecture that combines a Microprocessor Unit (MPU) and Field-Programmable Gate Array (FPGA). It features 256KB of RAM and a substantial number of I/O ports, totaling 480, making it highly versatile for a wide range of applications.

AGIB023R18A1E2V Features

  • High-Speed Processing: The AGIB023R18A1E2V operates at a speed of 1.4GHz, ensuring rapid data processing and efficient handling of complex tasks.
  • Wide Operating Temperature Range: With an operating temperature range of 0°C to 100°C (TJ), this SoC is suitable for use in various environmental conditions, including those with extreme temperatures.
  • Advanced Architecture: Combining MPU and FPGA, this architecture offers both high-speed processing and programmable logic capabilities, providing flexibility and adaptability for diverse applications.
  • Substantial RAM: The 256KB of RAM ensures ample memory for handling multiple tasks simultaneously, enhancing overall system performance.
  • Extensive I/O Connectivity: The SoC includes 480 I/O ports, providing extensive connectivity options for interfacing with various peripherals and devices.
  • Comprehensive Peripherals: Integrated peripherals such as DMA (Direct Memory Access) and WDT (Watchdog Timer) enhance the SoC's functionality and reliability.
  • Active Product Status: As an active product, the AGIB023R18A1E2V benefits from ongoing support and updates from Intel, ensuring long-term viability and compatibility.
  • Robust Connectivity Options: The SoC supports a wide range of connectivity protocols, including EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, facilitating seamless integration into various systems.
  • Reliable Packaging: The AGIB023R18A1E2V is packaged in a tray format with a Moisture Sensitivity Level (MSL) of 3 (168 Hours), ensuring protection during storage and handling.

AGIB023R18A1E2V Applications

The AGIB023R18A1E2V is ideal for applications that require high performance, flexibility, and extensive connectivity. Some specific use cases include:

  • Industrial Automation: The combination of MPU and FPGA allows for real-time control and processing in industrial environments, enhancing efficiency and reliability.
  • Embedded Systems: The SoC's extensive I/O and connectivity options make it suitable for embedded systems in various industries, from automotive to consumer electronics.
  • Telecommunications: The robust architecture and connectivity options enable the AGIB023R18A1E2V to be used in telecommunications infrastructure, providing high-speed data processing and reliable performance.
  • Medical Devices: The wide operating temperature range and extensive connectivity options make this SoC ideal for medical devices that require high reliability and adaptability.

Conclusion of AGIB023R18A1E2V

The AGIB023R18A1E2V from Intel's Agilex I series is a powerful and versatile SoC that offers a unique combination of high-speed processing, extensive connectivity, and robust architecture. Its 1.4GHz processing speed, 256KB of RAM, and 480 I/O ports make it suitable for a wide range of applications, from industrial automation to telecommunications. The SoC's extensive connectivity options and reliable packaging further enhance its appeal. For engineers and designers looking for a high-performance, flexible, and reliable SoC, the AGIB023R18A1E2V is an excellent choice.

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