Intel_AGID019R31B2E3E
Intel_AGID019R31B2E3E
original

Intel
AGID019R31B2E3E

777-AGID019R31B2E3E
IC FPGA AGILEX-I 3184FBGA
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
0°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
480
Peripherals
DMA, WDT
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AGID019R31B2E3E Description

AGID019R31B2E3E Description

The AGID019R31B2E3E is an advanced Embedded IC Chip belonging to the Agilex I series, manufactured by Intel. This IC is designed to deliver high performance and versatility in a compact 3184FBGA package. It features a 1.4GHz processing speed, making it suitable for demanding applications requiring rapid data processing and execution. The operating temperature range of 0°C to 100°C (TJ) ensures reliability in various environmental conditions, from industrial to automotive settings.

AGID019R31B2E3E Features

  • High-Speed Performance: With a clock speed of 1.4GHz, the AGID019R31B2E3E offers superior processing capabilities, ideal for applications requiring real-time data processing and complex computations.
  • Robust Architecture: The combination of MPU and FPGA architecture provides flexibility and scalability, allowing for efficient integration of both general-purpose processing and specialized hardware acceleration.
  • Substantial RAM: Equipped with 256KB of RAM, this IC can handle larger datasets and more complex algorithms compared to similar models with less memory.
  • Extensive I/O Connectivity: The AGID019R31B2E3E boasts 480 I/O pins, providing ample connections for interfacing with various peripherals and systems.
  • Rich Peripheral Set: Integrated peripherals such as DMA (Direct Memory Access) and WDT (Watchdog Timer) enhance system reliability and efficiency.
  • Versatile Connectivity Options: Supports a wide range of communication protocols including EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, making it highly adaptable for different application requirements.
  • Active Product Status: As an active product, customers can rely on consistent availability and ongoing support from Intel.
  • Packaging: The Tray packaging ensures safe handling and storage, suitable for both prototyping and mass production environments.

AGID019R31B2E3E Applications

The AGID019R31B2E3E is well-suited for a variety of applications across multiple industries:

  • Industrial Automation: Its high-speed processing and robust architecture make it ideal for controlling complex machinery and systems, enabling real-time monitoring and control.
  • Automotive Systems: The wide operating temperature range and extensive I/O capabilities support the development of advanced automotive electronics, such as engine control units and advanced driver-assistance systems (ADAS).
  • Telecommunications: The versatile connectivity options and high-speed performance are perfect for implementing high-speed data communication and networking solutions.
  • Consumer Electronics: The AGID019R31B2E3E can be used in smart devices, IoT gateways, and multimedia processing units, leveraging its powerful processing and memory capabilities.
  • Medical Devices: The reliability and extensive connectivity options are beneficial for medical imaging systems, patient monitoring devices, and other critical medical applications.

Conclusion of AGID019R31B2E3E

The AGID019R31B2E3E is a versatile and powerful Embedded IC Chip that stands out in its category due to its high-speed performance, robust architecture, and extensive connectivity options. Its 1.4GHz processing speed, 256KB of RAM, and 480 I/O pins provide significant advantages over similar models, making it an excellent choice for a wide range of applications. Whether used in industrial automation, automotive systems, telecommunications, consumer electronics, or medical devices, the AGID019R31B2E3E delivers reliable performance and scalability. Its active product status ensures ongoing support and availability, making it a reliable choice for both current and future projects.

FAQ

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