Intel_AGID019R31B2I3V
Intel_AGID019R31B2I3V
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Intel
AGID019R31B2I3V

777-AGID019R31B2I3V
IC FPGA AGILEX-I 3184FBGA
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
-40°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
480
Peripherals
DMA, WDT
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AGID019R31B2I3V Description

AGID019R31B2I3V Description

The AGID019R31B2I3V is a high-performance embedded IC chip from Intel's Agilex I series, designed to meet the demanding requirements of modern embedded systems. This IC features a 1.4GHz processing speed, leveraging a versatile architecture that combines a Microprocessor Unit (MPU) with Field-Programmable Gate Array (FPGA) capabilities. The chip is equipped with 256KB of RAM, providing ample memory for efficient data handling and processing. It also supports a robust number of I/O connections, totaling 480, which ensures seamless communication with various peripherals and devices.

AGID019R31B2I3V Features

  • High-Speed Processing: The 1.4GHz speed ensures rapid execution of complex tasks, making it suitable for real-time applications.
  • Hybrid Architecture: The MPU+FPGA architecture allows for both high-level processing and customizable hardware acceleration, offering flexibility and performance.
  • Substantial Memory: With 256KB of RAM, the AGID019R31B2I3V can handle large datasets and multiple tasks simultaneously.
  • Extensive I/O Capabilities: The 480 I/O connections provide extensive connectivity options, supporting a wide range of peripheral devices.
  • Advanced Peripherals: Integrated Direct Memory Access (DMA) and Watchdog Timer (WDT) enhance system efficiency and reliability.
  • Active Product Status: As an active product, the AGID019R31B2I3V benefits from ongoing support and updates from Intel.
  • Connectivity Options: The chip supports a variety of connectivity protocols, including EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, facilitating versatile integration into different systems.
  • Packaging: The Tray packaging ensures safe and efficient handling during manufacturing and assembly processes.

AGID019R31B2I3V Applications

The AGID019R31B2I3V is ideal for a wide range of applications due to its versatile architecture and extensive connectivity options. Some specific use cases include:

  • Industrial Automation: The high-speed processing and robust I/O capabilities make it suitable for controlling complex machinery and processes in industrial environments.
  • Telecommunications: The support for various connectivity protocols, including Ethernet and USB OTG, enables the development of advanced communication systems and network infrastructure.
  • Automotive Systems: The AGID019R31B2I3V can be used in advanced driver-assistance systems (ADAS) and infotainment systems, providing real-time processing and reliable performance.
  • Medical Devices: The chip's high reliability and advanced peripherals make it suitable for medical imaging and diagnostic equipment.
  • Consumer Electronics: The AGID019R31B2I3V can be integrated into smart home devices, gaming consoles, and other consumer electronics that require high performance and connectivity.

Conclusion of AGID019R31B2I3V

The AGID019R31B2I3V from Intel's Agilex I series is a powerful and versatile embedded IC chip that stands out in its category. Its hybrid MPU+FPGA architecture, combined with a high processing speed, substantial memory, and extensive connectivity options, makes it an excellent choice for a variety of applications. The chip's unique features, such as its advanced peripherals and robust I/O capabilities, provide significant advantages over similar models. Whether used in industrial automation, telecommunications, automotive systems, medical devices, or consumer electronics, the AGID019R31B2I3V delivers reliable performance and flexibility, making it a valuable component in modern embedded systems.

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