Intel_AGID023R18A1E1VB
Intel_AGID023R18A1E1VB
original

Intel
AGID023R18A1E1VB

777-AGID023R18A1E1VB
IC FPGA AGILEX-I 1805BGA
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
0°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
480
Peripherals
DMA, WDT
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AGID023R18A1E1VB Description

AGID023R18A1E1VB Description

The AGID023R18A1E1VB is an advanced Embedded IC Chip from Intel's Agilex I series, designed to deliver exceptional performance and versatility in a compact form factor. This IC features a powerful 1.4GHz processing speed, making it suitable for high-performance computing tasks. It operates within a wide temperature range of 0°C to 100°C (TJ), ensuring reliability in various environmental conditions. The architecture combines a Microprocessor Unit (MPU) and Field-Programmable Gate Array (FPGA), offering flexibility and programmability for a wide range of applications.

AGID023R18A1E1VB Features

  • High-Speed Processing: With a clock speed of 1.4GHz, the AGID023R18A1E1VB ensures rapid data processing and execution of complex algorithms.
  • Wide Operating Temperature Range: The operating temperature range of 0°C to 100°C (TJ) makes it suitable for applications in harsh environments, such as industrial automation and automotive systems.
  • Flexible Architecture: The combination of MPU and FPGA provides both high-level processing capabilities and the flexibility to customize hardware logic.
  • Robust Memory and I/O: Equipped with 256KB of RAM and 480 I/O pins, this IC can handle large datasets and support multiple peripheral connections.
  • Comprehensive Peripherals: Features include DMA (Direct Memory Access), WDT (Watchdog Timer), and various connectivity options like EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, enhancing its versatility.
  • Active Product Status: As an active product, the AGID023R18A1E1VB benefits from ongoing support and updates from Intel.
  • Packaging: The Tray packaging ensures safe and efficient handling during manufacturing and assembly processes.

AGID023R18A1E1VB Applications

The AGID023R18A1E1VB is ideal for a variety of high-performance applications, including:

  • Industrial Automation: Its robust performance and wide operating temperature range make it suitable for controlling complex machinery and processes in industrial settings.
  • Automotive Systems: The IC's ability to operate in extreme temperatures and its high-speed processing capabilities are beneficial for advanced driver-assistance systems (ADAS) and in-vehicle infotainment (IVI) systems.
  • Telecommunications: The extensive connectivity options and high-speed processing enable efficient data handling and communication in networking equipment.
  • Consumer Electronics: The AGID023R18A1E1VB can be used in high-end consumer devices that require advanced processing and connectivity, such as smart TVs and gaming consoles.
  • Medical Devices: Its reliability and high performance make it a good fit for medical imaging and diagnostic equipment where precision and speed are critical.

Conclusion of AGID023R18A1E1VB

The AGID023R18A1E1VB from Intel's Agilex I series is a versatile and high-performance Embedded IC Chip that stands out in its category. Its combination of MPU and FPGA architecture, along with a robust set of peripherals and connectivity options, makes it suitable for a wide range of applications. The wide operating temperature range and high-speed processing capabilities further enhance its reliability and performance. Whether used in industrial automation, automotive systems, telecommunications, consumer electronics, or medical devices, the AGID023R18A1E1VB offers significant advantages over similar models, making it a preferred choice for engineers and designers seeking a reliable and powerful solution.

FAQ

What is AGID023R18A1E1VB?
AGID023R18A1E1VB is a System On Chip (SoC) from Intel. This product page provides its main specifications, pricing information, availability, and inquiry options.
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