Intel_AGID023R18A2E2V
Intel_AGID023R18A2E2V
original

Intel
AGID023R18A2E2V

777-AGID023R18A2E2V
IC FPGA AGILEX-I 1805FBGA
12 Weeks

Why Choose Us?

Professional Platform

B2B & B2C purchasing

Delivery at full speed

1-2 days delivery

Wide variety

Original manufacturers

365 days guarantee

Responsible quality
APAC
ISO9001
Quality Policy
ISO45001
ISO14001
Original

Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
0°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
480
Peripherals
DMA, WDT
Show More

AGID023R18A2E2V Description

AGID023R18A2E2V Description

The AGID023R18A2E2V is an advanced embedded IC chip from Intel's Agilex I series, designed to deliver high performance and flexibility in a compact form factor. This IC integrates a powerful 1.4GHz processor with a robust architecture that includes both a Microprocessor Unit (MPU) and a Field-Programmable Gate Array (FPGA). It is equipped with 256KB of RAM and offers a substantial number of I/O ports, totaling 480, making it highly versatile for various applications. The AGID023R18A2E2V operates within a temperature range of 0°C to 100°C (TJ), ensuring reliability in diverse environmental conditions. It also features essential peripherals such as DMA and WDT, enhancing its functionality and performance.

AGID023R18A2E2V Features

  • High-Speed Performance: The 1.4GHz processing speed ensures rapid execution of complex tasks, making it suitable for high-performance computing and real-time processing applications.
  • Robust Architecture: The combination of MPU and FPGA architecture provides both programmable logic and microprocessor capabilities, offering flexibility and adaptability for a wide range of applications.
  • Substantial RAM: With 256KB of RAM, the AGID023R18A2E2V can handle larger datasets and more complex operations, enhancing overall system performance.
  • Extensive I/O Connectivity: The 480 I/O ports allow for extensive connectivity options, enabling seamless integration with various peripherals and systems.
  • Wide Operating Temperature Range: The ability to operate between 0°C and 100°C (TJ) makes it suitable for applications in harsh environments, ensuring reliability and durability.
  • Advanced Peripherals: Features such as DMA and WDT enhance system functionality and reliability, providing efficient data management and protection against system failures.
  • Active Product Status: As an active product, the AGID023R18A2E2V benefits from ongoing support and updates, ensuring long-term viability and compatibility.
  • Connectivity Options: The AGID023R18A2E2V supports a variety of connectivity options, including EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, facilitating integration into modern embedded systems.
  • Packaging and Moisture Sensitivity: The Tray packaging and MSL 3 (168 Hours) moisture sensitivity level ensure safe handling and storage, reducing the risk of damage during manufacturing and assembly processes.

AGID023R18A2E2V Applications

The AGID023R18A2E2V is ideal for a wide range of applications due to its high performance, flexibility, and robustness. Some specific use cases include:

  • Industrial Automation: The combination of high-speed processing and extensive I/O capabilities makes it suitable for controlling complex industrial processes and machinery.
  • Telecommunications: Its advanced connectivity options and high performance make it ideal for applications in communication infrastructure, such as base stations and network routers.
  • Automotive Systems: The wide operating temperature range and robust architecture ensure reliability in automotive applications, including advanced driver-assistance systems (ADAS) and in-vehicle infotainment systems.
  • Medical Devices: The AGID023R18A2E2V can be used in medical imaging equipment and diagnostic devices, where high performance and reliability are critical.
  • Consumer Electronics: Its versatility and connectivity options make it suitable for high-end consumer electronics, such as smart TVs and gaming consoles.

Conclusion of AGID023R18A2E2V

The AGID023R18A2E2V is a highly capable embedded IC chip that stands out in the market due to its advanced technical specifications and performance benefits. Its unique combination of MPU and FPGA architecture, coupled with a high-speed processor and substantial RAM, makes it a versatile solution for a wide range of applications. The extensive I/O connectivity, robust peripherals, and wide operating temperature range further enhance its reliability and adaptability. Whether used in industrial automation, telecommunications, automotive systems, medical devices, or consumer electronics, the AGID023R18A2E2V offers significant advantages over similar models, making it an excellent choice for engineers and designers seeking a high-performance, flexible, and reliable embedded solution.

FAQ

What operating temperature range does AGID023R18A2E2V support?
AGID023R18A2E2V has an operating temperature range of 0°C ~ 100°C (TJ).
Are there related or alternative parts for AGID023R18A2E2V?
Is AGID023R18A2E2V currently in stock?
What is the standard lead time for AGID023R18A2E2V?
What package or case is AGID023R18A2E2V available in?
Quick Quote
ADD TO RFQ LIST

Not available to buy online? Want the lower wholesale price? Please Send RFQ to get best price, we will respond immediately

QUICK RFQ