Intel_AGID023R31B2E3E
Intel_AGID023R31B2E3E
original

Intel
AGID023R31B2E3E

777-AGID023R31B2E3E
IC FPGA AGILEX-I 3184FBGA
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
0°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
480
Peripherals
DMA, WDT
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AGID023R31B2E3E Description

AGID023R31B2E3E Description

The AGID023R31B2E3E is a high-performance System on Chip (SoC) from Intel's Agilex I series, designed to meet the demands of modern embedded systems. This IC FPGA integrates a 1.4GHz MPU and FPGA architecture, offering a robust platform for complex processing tasks. With a RAM size of 256KB and 480 I/O ports, the AGID023R31B2E3E provides ample memory and connectivity options. It supports a wide range of peripherals, including DMA and WDT, ensuring efficient data management and system reliability. The operating temperature range of 0°C to 100°C (TJ) makes it suitable for various industrial environments. The AGID023R31B2E3E is packaged in a 3184FBGA format and is available in tray packaging, facilitating easy integration into diverse applications.

AGID023R31B2E3E Features

  • High-Speed Processing: The AGID023R31B2E3E features a 1.4GHz MPU, providing rapid processing capabilities essential for real-time applications.
  • Robust Architecture: Combining MPU and FPGA, this SoC offers a versatile architecture that supports both general-purpose processing and customizable logic functions.
  • Extensive Connectivity: With support for EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, the AGID023R31B2E3E ensures seamless integration with various peripherals and communication protocols.
  • Wide Operating Temperature Range: The operating temperature range of 0°C to 100°C (TJ) makes it suitable for applications in harsh environments, such as industrial automation and automotive systems.
  • Efficient Data Management: The inclusion of DMA and WDT peripherals enhances data transfer efficiency and system reliability, critical for mission-critical applications.
  • Active Product Status: As an active product, the AGID023R31B2E3E benefits from ongoing support and updates from Intel, ensuring long-term viability and compatibility.

AGID023R31B2E3E Applications

The AGID023R31B2E3E is ideal for a variety of applications that require high performance and flexibility. Some specific use cases include:

  • Industrial Automation: The robust architecture and wide temperature range make it suitable for controlling complex machinery and processes in industrial settings.
  • Automotive Systems: Its high-speed processing and extensive connectivity options are beneficial for advanced driver assistance systems (ADAS) and in-vehicle infotainment (IVI) systems.
  • Telecommunications: The AGID023R31B2E3E can be used in base stations and network equipment, providing efficient data processing and communication capabilities.
  • Consumer Electronics: Its versatility and performance make it suitable for high-end consumer devices, such as smart TVs and gaming consoles, where advanced processing and connectivity are required.
  • Medical Devices: The AGID023R31B2E3E can be used in medical imaging and diagnostic equipment, where real-time data processing and reliability are crucial.

Conclusion of AGID023R31B2E3E

The AGID023R31B2E3E from Intel's Agilex I series is a powerful and versatile SoC that offers significant advantages over similar models. Its high-speed processing capabilities, robust architecture, and extensive connectivity options make it suitable for a wide range of applications. The wide operating temperature range and efficient data management features further enhance its reliability and performance. Whether used in industrial automation, automotive systems, telecommunications, consumer electronics, or medical devices, the AGID023R31B2E3E provides a reliable and high-performance solution.

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What is AGID023R31B2E3E?
AGID023R31B2E3E is a System On Chip (SoC) from Intel. This product page provides its main specifications, pricing information, availability, and inquiry options.
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