Intel
AGID041R31B2E2VB

777-AGID041R31B2E2VB
IC
12 Weeks

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Tech Specifications

Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Speed
1.4GHz
Operating Temperature
0°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
732
Peripherals
DMA, WDT
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AGID041R31B2E2VB Description

AGID041R31B2E2VB Description

The AGID041R31B2E2VB is a high-performance System on Chip (SoC) from Intel's Agilex I series, designed to deliver exceptional processing capabilities and flexibility for a wide range of applications. This IC features a 1.4GHz processing speed, ensuring rapid execution of complex tasks. It operates within a temperature range of 0°C to 100°C (TJ), making it suitable for environments with varying thermal conditions. The architecture combines a Microprocessor Unit (MPU) and Field-Programmable Gate Array (FPGA), offering both high-speed processing and programmable logic capabilities.

AGID041R31B2E2VB Features

  • Speed: 1.4GHz, providing high-speed processing for demanding applications.
  • Operating Temperature: 0°C to 100°C (TJ), ensuring reliability in diverse thermal conditions.
  • Architecture: MPU and FPGA, combining general-purpose processing with customizable logic.
  • RAM Size: 256KB, offering sufficient memory for efficient data handling.
  • Number of I/O: 732, providing extensive connectivity options.
  • Peripherals: DMA (Direct Memory Access), WDT (Watchdog Timer), enhancing system performance and reliability.
  • Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG, supporting a wide range of communication protocols.
  • Package: Tray, facilitating easy handling and integration into various systems.
  • Product Status: Active, ensuring availability and support for ongoing projects.

AGID041R31B2E2VB Applications

The AGID041R31B2E2VB is ideal for applications requiring high processing power and flexibility. Its MPU and FPGA architecture makes it suitable for:

  • Embedded Systems: Where programmable logic can be customized for specific tasks.
  • Industrial Automation: Benefiting from its robust temperature range and extensive I/O capabilities.
  • Networking: Leveraging its Ethernet and USB OTG connectivity for high-speed data communication.
  • Consumer Electronics: Providing a versatile platform for various consumer devices.

Conclusion of AGID041R31B2E2VB

The AGID041R31B2E2VB stands out in the System on Chip (SoC) market due to its unique combination of MPU and FPGA architecture, high processing speed, and extensive connectivity options. Its ability to operate within a wide temperature range and support for multiple communication protocols makes it a versatile choice for a variety of applications. Whether used in embedded systems, industrial automation, networking, or consumer electronics, the AGID041R31B2E2VB offers reliable performance and significant advantages over similar models.

FAQ

What package or case is AGID041R31B2E2VB available in?
AGID041R31B2E2VB is available in the 3184-BFBGA Exposed Pad package / case.
What is AGID041R31B2E2VB?
Are there related or alternative parts for AGID041R31B2E2VB?
What operating temperature range does AGID041R31B2E2VB support?
Is AGID041R31B2E2VB currently in stock?
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