Intel_DH8900CC S LJW2
Intel_DH8900CC S LJW2
original

Intel
DH8900CC S LJW2

702-DH8900CC S LJW2
PDF Datasheet
Communications Chip 942-Pin FCBGA Tray
16 weeks

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Original

Tech Specifications

Category
Communications Chip
PCB changed
942
HTS
COMPONENTS
ECCN (US)
4A994i.
PPAP
No
Package Length
27.04(Max)
Standard Package Name
BGA
Automotive
No
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DH8900CC S LJW2 Description

The Tray for this electronic equipment is available. The packaging way of this DH8900CC S LJW2 is to conserve time, space, energy, and resources. This DH8900CC S LJW2 offers cheap cost, adaptability, dependability, efficiency, and consistency. This DH8900CC S LJW2 is produced by Intel and is used in a variety of industries. This manufacturer aspires to rank among the top electronic vendors in the Asia-Pacific region. Additionally, it hopes to contribute significantly to the sector's expansion. This DH8900CC S LJW2 falls under the Telecom category. The most advanced level of this category is Interface IC Chips. IC interfaces differ in terms of device types and applications. Some products are used with buffers, cardbus controllers, and crosspoint switches.

FAQ

Is DH8900CC S LJW2 currently in stock?
Yes. DH8900CC S LJW2 currently shows 1 unit(s) in stock.
What package or case is DH8900CC S LJW2 available in?
What is DH8900CC S LJW2?
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