Intel_EP2AGX260EF29I3G
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Intel
EP2AGX260EF29I3G

696-EP2AGX260EF29I3G
IC FPGA 372 I/O 780FBGA
26 Weeks

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Tech Specifications

Operating Temperature
-40°C ~ 100°C (TJ)
Total RAM Bits
12038144
Number of LABs/CLBs
10260
Number of I/O
372
Mounting Type
Surface Mount
Product Status
Active
Supplier Device Package
780-FBGA (29x29)
Series
Arria II GX
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EP2AGX260EF29I3G Description

Intel's EP2AGX260EF29I3G is a high-performance, low-power FPGA (Field-Programmable Gate Array) module designed for a wide range of industrial and commercial applications. This module is based on the Intel Cyclone V E FPGA device and offers a combination of features that make it an ideal choice for various applications.

Description:

The EP2AGX260EF29I3G is a compact and versatile module that measures 68mm x 36mm and has a thickness of just 3.4mm. It features a 28-nm low-power process technology and a 2.29 GHz transceiver, making it suitable for high-speed data transmission and communication applications. The module also includes a range of I/O options, including DDR3 memory, PCIe, and Gigabit Ethernet, allowing for easy integration with other components and systems.

Features:

  1. Intel Cyclone V E FPGA device: The EP2AGX260EF29I3G is based on the Intel Cyclone V E FPGA, which offers high performance, low power consumption, and a wide range of configurable features.
  2. 28-nm low-power process technology: This technology allows the module to operate at lower power levels, making it suitable for energy-efficient applications.
  3. 2.29 GHz transceiver: The module features a high-speed transceiver that supports data transmission rates of up to 2.29 GHz, making it ideal for communication and networking applications.
  4. DDR3 memory interface: The module includes a DDR3 memory interface, providing high-speed memory access for data-intensive applications.
  5. PCIe interface: The module supports PCIe (Peripheral Component Interconnect Express) interface, allowing for high-speed data transfer between the module and other components.
  6. Gigabit Ethernet: The module features Gigabit Ethernet connectivity, enabling fast and reliable network communication.
  7. Compact form factor: With dimensions of 68mm x 36mm and a thickness of just 3.4mm, the EP2AGX260EF29I3G is a compact and space-saving solution for various applications.

Applications:

The Intel EP2AGX260EF29I3G is suitable for a wide range of applications, including but not limited to:

  1. Industrial automation and control systems: The module's high-speed data transmission capabilities and low power consumption make it ideal for use in industrial automation and control systems.
  2. Networking and communication equipment: The module's Gigabit Ethernet and PCIe interfaces make it suitable for use in networking and communication equipment, such as routers, switches, and modems.
  3. Embedded systems: The compact form factor and versatile I/O options of the EP2AGX260EF29I3G make it an excellent choice for embedded systems in various industries.
  4. Data acquisition and signal processing: The module's high-speed transceiver and configurable features make it suitable for data acquisition and signal processing applications.
  5. Military and aerospace applications: The EP2AGX260EF29I3G's reliability and performance make it suitable for use in military and aerospace applications, where high-speed data transmission and low power consumption are critical.

In summary, the Intel EP2AGX260EF29I3G is a high-performance, low-power FPGA module that offers a range of features and applications, making it an ideal choice for various industries and applications.

FAQ

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The standard lead time for EP2AGX260EF29I3G is 26 Weeks.
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