Intel_EP2AGX260FF35I3N
original

Intel
EP2AGX260FF35I3N

696-EP2AGX260FF35I3N
Field Programmable Gate Array, 500MHz, 244188-Cell, CMOS, PBGA1152, 35 X 35 MM, LEAD FREE, MS-034, FBGA-1152

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Tech Specifications

Package/Case
FBGA
Data Rate
600Mbps
Frequency
500MHz
Max Frequency
390MHz
Max Operating Temperature
100°C
Min Operating Temperature
-40°C
Max Supply Voltage
930mV
Memory Size
11756Kb
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EP2AGX260FF35I3N Description

EP2AGX260FF35I3N Description

The EP2AGX260FF35I3N is an IC FPGA from Intel's Arria II GX series, designed for high-performance embedded applications. This Field Programmable Gate Array (FPGA) offers a robust set of features tailored for complex digital signal processing and data-intensive tasks. With a total of 612 I/Os, it is packaged in an 1152FBGA format, making it suitable for surface mount applications. The device operates within a supply voltage range of 0.87V to 0.93V, ensuring efficient power management and thermal performance.

EP2AGX260FF35I3N Features

  • High Logic Density: The EP2AGX260FF35I3N features 244,188 logic elements/cells and 10,260 LABs/CLBs, providing substantial computational capacity for complex algorithms and large-scale digital designs.
  • Substantial RAM: Equipped with 12,038,144 total RAM bits, this FPGA can handle extensive data storage and processing tasks, making it ideal for applications requiring high memory bandwidth.
  • Robust I/O Capabilities: The 612 I/Os support a wide range of communication protocols and interfaces, enabling seamless integration with various peripheral devices and systems.
  • Surface Mount Compatibility: The surface mount mounting type ensures ease of integration into modern PCB designs, optimizing space utilization and enhancing mechanical stability.
  • RoHS Compliance: As a RoHS-compliant device, the EP2AGX260FF35I3N meets stringent environmental standards, making it suitable for eco-friendly electronics manufacturing.
  • Moisture Sensitivity Level (MSL): Rated at MSL 3 (168 Hours), this FPGA is designed to withstand moisture exposure during manufacturing processes, ensuring reliability and longevity.

EP2AGX260FF35I3N Applications

The EP2AGX260FF35I3N is well-suited for a variety of high-performance applications, including:

  • Telecommunications: Ideal for base station processing, signal routing, and network protocol handling due to its high I/O count and robust logic density.
  • Data Centers: Suitable for high-speed data processing and storage applications, leveraging its extensive RAM and logic capabilities.
  • Industrial Automation: Can be used in complex control systems, real-time data acquisition, and process automation due to its reliability and high-performance characteristics.
  • Medical Imaging: Effective in applications requiring rapid data processing and high memory bandwidth, such as MRI and CT scan systems.
  • Military and Aerospace: Applicable in radar systems, avionics, and other critical applications where reliability and performance are paramount.

Conclusion of EP2AGX260FF35I3N

The EP2AGX260FF35I3N from Intel's Arria II GX series is a powerful FPGA designed to meet the demands of high-performance embedded systems. Its high logic density, substantial RAM, and robust I/O capabilities make it a versatile solution for a wide range of applications. Despite its obsolete status, the EP2AGX260FF35I3N remains a reliable choice for engineers seeking a high-performance FPGA with extensive features. Its RoHS compliance and surface mount compatibility further enhance its appeal for modern electronics manufacturing.

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