Intel_EP2AGX260FF35I3NAB
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Intel
EP2AGX260FF35I3NAB

696-EP2AGX260FF35I3NAB
IC FPGA 612 I/O 1152FBGA

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Tech Specifications

Operating Temperature
-40°C ~ 100°C (TJ)
Total RAM Bits
12038144
Number of LABs/CLBs
10260
ECCN
OBSOLETE
Number of I/O
612
Mounting Type
Surface Mount
Product Status
Obsolete
Supplier Device Package
1152-FBGA (35x35)
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EP2AGX260FF35I3NAB Description

Intel's EP2AGX260FF35I3NAB is a high-performance, low-power FPGA (Field Programmable Gate Array) device designed for a wide range of applications in the industrial, medical, and communications markets. This device offers a combination of features and capabilities that make it an ideal choice for demanding applications that require high performance, low power consumption, and flexibility.

Description:

The EP2AGX260FF35I3NAB is a member of Intel's Cyclone V family of FPGAs. It is a mid-range device that offers a balance of performance, power efficiency, and cost-effectiveness. The device is available in a compact 256-ball FBGA package, making it suitable for a wide range of applications where space is at a premium.

Features:

  1. Performance: The EP2AGX260FF35I3NAB offers high performance with up to 260 KLEs (Logic Elements) and 8,320 ALMs (Adaptive Logic Modules) for complex logic designs.
  2. Low Power: The device is designed for low power consumption, making it ideal for battery-powered and energy-sensitive applications.
  3. Memory: The FPGA features up to 544 Kbits of ultra-high-performance memory blocks and 34 Mbits of single-port block RAM, providing ample memory resources for data storage and processing.
  4. I/O: The device offers a wide range of I/O options, including LVCMOS, 1.2V, 1.5V, and 3.3V I/O standards, as well as support for DDR and QDR memory interfaces.
  5. Security: The EP2AGX260FF35I3NAB includes advanced security features, such as secure boot and bitstream encryption, to protect intellectual property and ensure data integrity.
  6. Flexibility: The FPGA is highly configurable, allowing users to customize the device to meet their specific application requirements.

Applications:

  1. Industrial Automation: The EP2AGX260FF35I3NAB is well-suited for industrial automation applications, such as motor control, robotics, and machine vision, due to its high performance, low power consumption, and robust I/O capabilities.
  2. Medical Electronics: The device's low power consumption and advanced security features make it an excellent choice for medical electronics, including imaging systems, patient monitoring devices, and diagnostic equipment.
  3. Communications: The EP2AGX260FF35I3NAB is ideal for communications applications, such as base stations, routers, and switches, due to its high performance, low latency, and support for high-speed interfaces.
  4. Automotive: The FPGA's reliability, low power, and flexibility make it suitable for automotive applications, including infotainment systems, advanced driver assistance systems (ADAS), and in-vehicle networking.
  5. Aerospace and Defense: The EP2AGX260FF35I3NAB can be used in aerospace and defense applications, such as satellite communications, radar systems, and secure communication devices, due to its high performance, low power, and advanced security features.

In summary, Intel's EP2AGX260FF35I3NAB is a versatile, high-performance FPGA that offers a combination of features and capabilities that make it suitable for a wide range of applications in the industrial, medical, communications, automotive, and aerospace and defense markets. Its low power consumption, advanced security features, and flexibility make it an ideal choice for demanding applications that require high performance and reliability.

FAQ

What operating temperature range does EP2AGX260FF35I3NAB support?
EP2AGX260FF35I3NAB has an operating temperature range of -40°C ~ 100°C (TJ).
What is the mounting type of EP2AGX260FF35I3NAB?
What is EP2AGX260FF35I3NAB?
What voltage specification is listed for EP2AGX260FF35I3NAB?
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