Intel_EP2AGX260FF35I5G
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Intel
EP2AGX260FF35I5G

696-EP2AGX260FF35I5G
PDF Datasheet
IC FPGA 612 I/O 1152FBGA
26 Weeks

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Tech Specifications

Operating Temperature
-40°C ~ 100°C (TJ)
Total RAM Bits
12038144
Number of LABs/CLBs
10260
ECCN
3A991D
Number of I/O
612
Mounting Type
Surface Mount
Product Status
Active
Supplier Device Package
1152-FBGA (35x35)
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EP2AGX260FF35I5G Description

EP2AGX260FF35I5G Description

The EP2AGX260FF35I5G is a high-performance Field Programmable Gate Array (FPGA) from Intel, belonging to the Arria II GX series. This embedded IC chip is designed for complex digital signal processing and high-speed communication applications. It features a robust architecture with 10,260 Logic Array Blocks (LABs) or Configurable Logic Blocks (CLBs), and a total of 244,188 logic elements/cells, providing extensive programmability and flexibility. The device supports a wide range of I/O configurations, with 612 I/O pins, making it suitable for various interfacing requirements.

The EP2AGX260FF35I5G operates within a supply voltage range of 0.87V to 0.93V, ensuring efficient power management and thermal performance. It is packaged in a 1152-pin Fine Ball Grid Array (FBGA) format, ideal for surface mount technology (SMT) applications. The device is moisture sensitivity level (MSL) 3 rated, allowing for safe handling and storage up to 168 hours in a controlled environment.

EP2AGX260FF35I5G Features

  • High Logic Density: With 10,260 LABs/CLBs and 244,188 logic elements/cells, the EP2AGX260FF35I5G offers significant computational power and flexibility for complex digital designs.
  • Extensive I/O Capability: The device supports 612 I/O pins, providing ample interfacing options for various peripheral devices and communication protocols.
  • Efficient Power Management: Operating within a supply voltage range of 0.87V to 0.93V, the FPGA ensures low power consumption and optimal thermal performance.
  • Robust Packaging: The 1152-pin FBGA package is designed for surface mount applications, ensuring reliable mechanical and electrical performance.
  • Moisture Sensitivity Level 3: The MSL 3 rating allows for safe handling and storage up to 168 hours, reducing the risk of moisture-related damage.
  • Compliance and Safety: The EP2AGX260FF35I5G is REACH unaffected and RoHS compliant, ensuring it meets environmental and safety standards.
  • Active Product Status: The device is actively supported by Intel, ensuring availability and ongoing technical support.

EP2AGX260FF35I5G Applications

The EP2AGX260FF35I5G is ideal for a wide range of high-performance applications, including:

  • Telecommunications: High-speed data transmission and signal processing in base stations and network infrastructure.
  • Data Centers: Efficient data processing and management in server farms and cloud computing environments.
  • Industrial Automation: Real-time control and monitoring systems in manufacturing plants and industrial processes.
  • Medical Imaging: Advanced image processing and diagnostic systems in medical facilities.
  • Aerospace and Defense: Reliable and high-performance computing for avionics, radar systems, and other critical applications.

Conclusion of EP2AGX260FF35I5G

The EP2AGX260FF35I5G FPGA from Intel is a versatile and high-performance solution for demanding digital applications. Its extensive logic density, robust I/O capabilities, and efficient power management make it an ideal choice for various industries. The device's compliance with environmental and safety standards, along with its active product status, ensures long-term reliability and support. Whether used in telecommunications, data centers, industrial automation, medical imaging, or aerospace and defense, the EP2AGX260FF35I5G offers superior performance and flexibility, making it a standout choice in the FPGA market.

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