Intel_EP2SGX130GF1508C4
original

Intel
EP2SGX130GF1508C4

696-EP2SGX130GF1508C4
PDF Datasheet
Field Programmable Gate Array, 132540 CLBs, 717MHz, 132540-Cell, CMOS, PBGA1508, 40 X 40 MM, 1 MM PITCH, MS-034AAU-1, FBGA-1508

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Tech Specifications

Package/Case
FBGA
Data Rate
600Mbps
Frequency
732.1MHz
Lead Free
Contains Lead
Max Operating Temperature
85°C
Max Supply Voltage
1.25V
Memory Size
6747840b
Min Operating Temperature
0°C
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EP2SGX130GF1508C4 Description

EP2SGX130GF1508C4 Description

The EP2SGX130GF1508C4 is an IC FPGA from Intel's Stratix® II GX series, designed for high-performance embedded applications. This Field-Programmable Gate Array (FPGA) features 132,540 logic elements and 6,627 Logic Array Blocks (LABs), providing extensive programmability and flexibility. With 734 I/Os and a total of 6,747,840 RAM bits, this device is well-suited for complex digital signal processing and high-speed communication tasks. The operating temperature range of 0°C to 85°C (TJ) ensures reliable performance in various environmental conditions. The EP2SGX130GF1508C4 is packaged in a 1508 BGA format, ideal for surface-mount applications, and operates within a supply voltage range of 1.15V to 1.25V. Although this product is now obsolete, its robust design and capabilities make it a valuable component for legacy systems.

EP2SGX130GF1508C4 Features

  • High Logic Density: With 132,540 logic elements and 6,627 LABs, the EP2SGX130GF1508C4 offers significant computational power and flexibility for complex designs.
  • Extensive I/O Capability: The device supports 734 I/Os, making it suitable for applications requiring high connectivity and interfacing with multiple peripherals.
  • Large RAM Capacity: Total RAM bits of 6,747,840 provide ample storage for data-intensive operations, enhancing the FPGA's ability to handle complex algorithms and large datasets.
  • Wide Operating Temperature Range: The operating temperature range of 0°C to 85°C (TJ) ensures reliable performance across various industrial and commercial environments.
  • Surface-Mount Compatibility: The surface-mount package type facilitates easy integration into modern PCB designs, optimizing space utilization and improving thermal performance.
  • Moisture Sensitivity Level (MSL): MSL 3 (168 hours) ensures the device is protected against moisture during manufacturing and storage processes, reducing the risk of damage.

EP2SGX130GF1508C4 Applications

The EP2SGX130GF1508C4 is ideal for a wide range of high-performance embedded applications, including:

  • Telecommunications: High-speed signal processing and data routing in communication infrastructure.
  • Military and Aerospace: Robust and reliable processing for mission-critical systems, benefiting from the wide operating temperature range and high logic density.
  • Industrial Automation: Complex control systems requiring extensive I/O and real-time processing capabilities.
  • Medical Imaging: High-speed data processing for medical diagnostic equipment, ensuring precise and rapid image generation.
  • Data Centers: Efficient data routing and processing in high-performance computing environments.

Conclusion of EP2SGX130GF1508C4

The EP2SGX130GF1508C4, despite being obsolete, remains a powerful and versatile FPGA solution for legacy systems. Its high logic density, extensive I/O capability, and large RAM capacity make it suitable for a variety of demanding applications. The robust design, wide operating temperature range, and surface-mount compatibility further enhance its appeal for industrial and commercial use. For engineers and designers working with legacy systems, the EP2SGX130GF1508C4 offers a reliable and capable solution, ensuring continued performance and functionality.

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