Intel

EP3C25F256C8N

EP3C25F256C8N Description

The EP3C25F256C8N is an IC FPGA from Intel's Cyclone® III series, designed for high-performance embedded applications. This device features a total of 156 I/Os and is packaged in a 256FBGA format, making it suitable for surface mount applications. It operates within a temperature range of 0°C to 85°C (TJ) and requires a supply voltage between 1.15V and 1.25V. The EP3C25F256C8N includes 608,256 total RAM bits and 1,539 LABs/CLBs, providing robust memory and logic capabilities. With 24,624 logic elements/cells, this FPGA is well-suited for complex digital designs. The device is REACH unaffected, RoHS compliant, and has a moisture sensitivity level (MSL) of 3 (168 hours), ensuring reliability in various environmental conditions.

EP3C25F256C8N Features

• High Logic Capacity: The EP3C25F256C8N boasts 24,624 logic elements/cells and 1,539 LABs/CLBs, offering significant processing power for complex digital designs.
• Robust Memory: With 608,256 total RAM bits, this FPGA provides ample memory for data storage and processing, making it ideal for applications requiring high data throughput.
• Wide I/O Capability: The device features 156 I/Os, enabling extensive connectivity options for interfacing with various peripherals and systems.
• Flexible Power Supply: Operating within a voltage range of 1.15V to 1.25V, the EP3C25F256C8N offers flexibility in power management, suitable for both low-power and high-performance applications.
• Reliability and Compliance: The EP3C25F256C8N is REACH unaffected and RoHS compliant, ensuring it meets environmental and safety standards. Its MSL of 3 (168 hours) makes it suitable for a wide range of operating conditions.
• Surface Mount Compatibility: The surface mount mounting type and 256FBGA package format make the EP3C25F256C8N ideal for compact and high-density PCB designs.

EP3C25F256C8N Applications

The EP3C25F256C8N is well-suited for a variety of applications due to its high logic capacity, robust memory, and wide I/O capability. Some specific use cases include:

• Embedded Systems: Ideal for high-performance embedded systems requiring extensive processing and memory capabilities.
• Digital Signal Processing (DSP): Suitable for applications involving complex signal processing tasks, such as audio and video processing.
• Telecommunications: Can be used in telecom infrastructure for signal routing, switching, and processing.
• Industrial Automation: Provides the necessary logic and memory for controlling complex industrial processes and machinery.
• Consumer Electronics: Ideal for high-end consumer electronics requiring advanced digital processing capabilities.

Conclusion of EP3C25F256C8N

The EP3C25F256C8N from Intel's Cyclone® III series is a versatile and powerful FPGA designed for high-performance embedded applications. Its high logic capacity, robust memory, and wide I/O capability make it suitable for a variety of complex digital designs. The device's flexibility in power supply, reliability, and compliance with environmental standards further enhance its appeal. Whether used in embedded systems, digital signal processing, telecommunications, industrial automation, or consumer electronics, the EP3C25F256C8N offers significant advantages over similar models, making it a top choice for engineers and designers in the electronics industry.