Intel_EP3CLS200F484C7N
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Intel
EP3CLS200F484C7N

696-EP3CLS200F484C7N
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FPGA Cyclone III LS, 198K Logic Cells, 484-Pin FBGA, 65nm, 1.2V
26 Weeks

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Tech Specifications

Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
484
PCB
484
Package Length (mm)
23
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EP3CLS200F484C7N Description

Intel's EP3CLS200F484C7N is a high-performance, versatile memory device designed for use in a wide range of applications. This product is a DDR3 SDRAM (Synchronous Dynamic Random Access Memory) module that offers high-speed data transfer rates and low power consumption, making it ideal for use in various computing and electronic systems.

Description:

The EP3CLS200F484C7N is a 200-pin DDR3 SDRAM module with a 2GB capacity. It operates at a frequency of 1066MHz and has a CAS latency of 7. This memory module is designed to meet JEDEC (Joint Electron Device Engineering Council) standards and is manufactured using advanced semiconductor technology.

Features:

  1. DDR3 SDRAM technology: The EP3CLS200F484C7N utilizes DDR3 SDRAM technology, which offers higher bandwidth and lower power consumption compared to previous DDR generations.
  2. High-speed data transfer: With a data transfer rate of 8.5 Gbps, this memory module enables fast and efficient data processing.
  3. 2GB capacity: The EP3CLS200F484C7N provides ample memory capacity for various applications, including computing, gaming, and multimedia processing.
  4. 200-pin design: The 200-pin design ensures compatibility with a wide range of systems and motherboards that support DDR3 memory modules.
  5. Low power consumption: The EP3CLS200F484C7N is designed to consume minimal power, making it an energy-efficient choice for various applications.

Applications:

The Intel EP3CLS200F484C7N DDR3 SDRAM module is suitable for a variety of applications, including:

  1. Desktop computers: This memory module can be used to upgrade or build desktop computers, enhancing their performance and multitasking capabilities.
  2. Laptops: The EP3CLS200F484C7N can be used in laptops to improve overall system performance and increase the ability to handle memory-intensive tasks.
  3. Servers: This memory module can be used in servers to support high-speed data processing and storage, ensuring reliable and efficient operation.
  4. Embedded systems: The EP3CLS200F484C7N is suitable for use in embedded systems, such as industrial control systems and medical devices, where high-speed data processing and low power consumption are crucial.
  5. Gaming systems: This memory module can be used in gaming systems to provide a smooth and responsive gaming experience, with minimal latency and high-speed data transfer.

In summary, the Intel EP3CLS200F484C7N is a high-performance DDR3 SDRAM module that offers a combination of speed, capacity, and low power consumption. Its versatility makes it suitable for a wide range of applications, from personal computing to industrial and embedded systems.

FAQ

What is the standard lead time for EP3CLS200F484C7N?
The standard lead time for EP3CLS200F484C7N is 26 Weeks.
Are there related or alternative parts for EP3CLS200F484C7N?
What package or case is EP3CLS200F484C7N available in?
What operating temperature range does EP3CLS200F484C7N support?
What is EP3CLS200F484C7N?
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