Intel_EP3CLS200F484I7N
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Intel
EP3CLS200F484I7N

696-EP3CLS200F484I7N
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FPGA Cyclone III LS, 198K Cells, 65nm, 484-Pin FBGA, 1.2V
26 Weeks

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Tech Specifications

Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
484
PCB
484
Package Length (mm)
23
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EP3CLS200F484I7N Description

Intel's EP3CLS200F484I7N is a high-performance, versatile memory module designed for use in various computing applications. Here's a description of the model, its features, and potential applications:

Model: EP3CLS200F484I7N

Description:

The EP3CLS200F484I7N is a DDR4 Registered DIMM (RDIMM) memory module developed by Intel. It is designed to meet the demands of high-performance computing systems, offering improved speed, reliability, and energy efficiency.

Features:

  1. DDR4 Technology: The module utilizes DDR4 memory technology, which provides faster data transfer rates and lower power consumption compared to previous DDR3 memory generations.

  2. High Capacity: The EP3CLS200F484I7N offers a large memory capacity, allowing for efficient handling of large datasets and complex applications.

  3. Registered DIMM (RDIMM): This module is a registered DIMM, which means it includes a register between the memory chips and the memory controller. This register helps improve signal integrity and stability, making it suitable for high-performance computing environments.

  4. Error-Correcting Code (ECC): The memory module supports ECC, which helps protect against data corruption and ensures reliable operation in critical applications.

  5. CAS Latency: The module features a CAS latency (CL) of 28, which is a measure of the time it takes for the memory to respond to a request from the memory controller. Lower CL values generally result in faster memory performance.

  6. Voltage: The EP3CLS200F484I7N operates at a voltage of 1.2V, contributing to its energy efficiency.

Applications:

  1. Server Infrastructure: The EP3CLS200F484I7N is well-suited for server environments, where high-performance memory is crucial for handling large workloads, data processing, and multitasking.

  2. Data Centers: In data center applications, the memory module's reliability and performance can help ensure smooth operation and minimize downtime.

  3. High-Performance Computing (HPC): The module's DDR4 technology and high capacity make it an excellent choice for HPC applications, where processing large datasets and complex simulations is required.

  4. Cloud Computing: In cloud computing environments, the EP3CLS200F484I7N can help provide the necessary memory resources to support virtual machines and other cloud-based services.

  5. Enterprise Applications: For businesses that rely on enterprise resource planning (ERP), content management systems (CMS), or other resource-intensive applications, the EP3CLS200F484I7N can help improve performance and responsiveness.

  6. Embedded Systems: The memory module can also be used in embedded systems where high-performance memory is required for real-time processing and data handling.

In summary, Intel's EP3CLS200F484I7N is a high-capacity, high-performance DDR4 RDIMM memory module designed for use in various computing applications, including servers, data centers, high-performance computing, cloud computing, enterprise applications, and embedded systems. Its features, such as DDR4 technology, ECC support, and low voltage operation, make it a reliable and efficient choice for demanding computing environments.

FAQ

What is the mounting type of EP3CLS200F484I7N?
EP3CLS200F484I7N uses a Surface Mount mounting style based on the listed product specifications.
Is EP3CLS200F484I7N currently in stock?
What package or case is EP3CLS200F484I7N available in?
What operating temperature range does EP3CLS200F484I7N support?
What is EP3CLS200F484I7N?
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