Intel_EP3CLS70U484C8N
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Intel
EP3CLS70U484C8N

696-EP3CLS70U484C8N
PDF Datasheet
FPGA 70K Logic Cells 402MHz 65nm 484-Pin UFBGA
26 Weeks

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Tech Specifications

Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
UFBGA
Package Description
Ultra Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
484
PCB
484
Package Length (mm)
19
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EP3CLS70U484C8N Description

The Intel EP3CLS70U484C8N is a high-performance, versatile FPGA (Field Programmable Gate Array) module designed for a wide range of applications in various industries. This module is based on the Intel Cyclone V E FPGA device, which offers a combination of high performance, low power consumption, and advanced features.

Description:

The EP3CLS70U484C8N is a compact, high-density FPGA module that provides a complete solution for embedded systems, communication systems, and other applications requiring high-speed data processing and flexible I/O options. The module features a 484-pin FBGA package, making it suitable for high-density applications with limited board space.

Features:

  1. Intel Cyclone V E FPGA device: The module is based on the Intel Cyclone V E FPGA, which offers a high-performance, low-power solution with a wide range of features and capabilities.
  2. High-density I/O: The module provides a large number of I/O pins, making it suitable for applications requiring a high number of input/output connections.
  3. Compact form factor: The 484-pin FBGA package allows for a compact form factor, making it suitable for applications with limited board space.
  4. Wide operating temperature range: The module is designed to operate in a wide temperature range of -40°C to +105°C, making it suitable for various environments.
  5. Advanced features: The module supports advanced features such as DDR3 memory interfaces, PCIe interfaces, and high-speed transceivers, making it suitable for a wide range of applications.

Applications:

  1. Embedded systems: The EP3CLS70U484C8N is ideal for embedded systems that require high-speed data processing, flexible I/O options, and a compact form factor.
  2. Communication systems: The module's high-speed transceivers and PCIe interfaces make it suitable for communication systems, such as network infrastructure and data center applications.
  3. Industrial automation: The module's robustness and wide operating temperature range make it suitable for industrial automation applications, such as motor control and machine vision systems.
  4. Aerospace and defense: The EP3CLS70U484C8N can be used in aerospace and defense applications, where high reliability, performance, and security are critical.
  5. High-performance computing: The module's advanced features and high-speed data processing capabilities make it suitable for high-performance computing applications, such as data analytics and artificial intelligence.

In summary, the Intel EP3CLS70U484C8N is a high-performance, versatile FPGA module that offers a combination of features and capabilities suitable for a wide range of applications in various industries. Its compact form factor, high-density I/O, and advanced features make it an ideal choice for embedded systems, communication systems, industrial automation, aerospace and defense, and high-performance computing applications.

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