Intel
EP3SE260F1152C2N  
FPGAs

Intel
EP3SE260F1152C2N
696-EP3SE260F1152C2N
Ersa
Intel-EP3SE260F1152C2N-datasheets-4550251.pdf
IC FPGA 744 I/O 1152FBGA
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EP3SE260F1152C2N Description

The Intel EP3SE260F1152C2N is a high-performance FPGA (Field-Programmable Gate Array) module designed for use in a wide range of applications. This module is based on the Intel Cyclone V E FPGA device and offers a combination of features that make it suitable for various industries, including industrial automation, automotive, medical, and communication systems.

Description:

The Intel EP3SE260F1152C2N is a compact and versatile module that measures 90mm x 90mm and has a thickness of 8mm. It features a 115.2mm x 115.2mm FCBGA (Fine-Pitch Ball Grid Array) package with 1219 I/O (Input/Output) pins. The module is designed to provide high-density integration and low power consumption, making it an ideal choice for applications that require high performance and reliability.

Features:

  1. Intel Cyclone V E FPGA device: The module is based on the Intel Cyclone V E FPGA, which is known for its low power consumption, high performance, and advanced features.
  2. High I/O count: With 1219 I/O pins, the module offers a high-density integration, allowing for complex designs and a wide range of peripherals to be connected.
  3. Compact form factor: The 90mm x 90mm module size makes it suitable for applications where space is a constraint.
  4. Low power consumption: The module is designed to consume low power, making it suitable for battery-operated or energy-sensitive applications.
  5. Industrial temperature range: The module operates in an extended industrial temperature range of -40°C to +85°C, ensuring reliable operation in harsh environments.
  6. RoHS compliant: The module is compliant with the Restriction of Hazardous Substances (RoHS) directive, making it an environmentally friendly choice.

Applications:

  1. Industrial automation: The Intel EP3SE260F1152C2N can be used in industrial automation systems for control, monitoring, and communication applications.
  2. Automotive: The module can be used in automotive applications such as infotainment systems, advanced driver assistance systems (ADAS), and body control modules.
  3. Medical: The FPGA module can be used in medical equipment for signal processing, image processing, and control applications.
  4. Communication systems: The module can be used in communication systems for data processing, protocol conversion, and network management.
  5. Embedded vision: The Intel EP3SE260F1152C2N can be used in embedded vision applications for image processing, object detection, and machine learning tasks.

In summary, the Intel EP3SE260F1152C2N is a high-performance FPGA module that offers a combination of features, including a high I/O count, compact form factor, low power consumption, and industrial temperature range. This makes it suitable for a wide range of applications across various industries, including industrial automation, automotive, medical, and communication systems.

Tech Specifications

Operating Temperature
Total RAM Bits
Number of LABs/CLBs
ECCN
Number of I/O
Mounting Type
Product Status
Supplier Device Package
Series
Package / Case
Voltage - Supply
Mfr
HTSUS
Package
Number of Logic Elements/Cells
RoHS Status
Base Product Number
Moisture Sensitivity Level (MSL)

EP3SE260F1152C2N Documents

Download datasheets and manufacturer documentation for EP3SE260F1152C2N

Ersa Stratix III Device Family Overview       Stratix III Device Handbook      
Ersa Mult Dev Label Chgs 24/Feb/2020       Mult Dev Label CHG 24/Jan/2020      
Ersa Virtual JTAG Megafuntion Guide      
Ersa Readiness Plan Update 3/Apr/2020      
Ersa Mult Dev EOL Rev 30/Mar/2020       Mult Dev EOL 30/Mar/2020       Mult Dev Add Subs 6/Sep/2019      
Ersa Mult Series Software Chgs 26/Mar/2020      

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