Intel_EP3SE260F1152C3N
original

Intel
EP3SE260F1152C3N

696-EP3SE260F1152C3N
PDF Datasheet
Field Programmable Gate Array, 717MHz, 255000-Cell, CMOS, PBGA1152, LEAD FREE, FBGA-1152

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Tech Specifications

Package/Case
FBGA
Frequency
500MHz
Lead Free
Lead Free
Max Frequency
500MHz
Max Operating Temperature
85°C
Memory Size
16282Kb
Min Operating Temperature
0°C
Max Supply Voltage
1.15V
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EP3SE260F1152C3N Description

Intel's EP3SE260F1152C3N is a high-performance, versatile FPGA (Field-Programmable Gate Array) module designed for a wide range of applications. This module is based on the Intel® Stratix® 10 GX 1150 device and offers a combination of features that make it suitable for various industries and applications.

Description:

The EP3SE260F1152C3N is a compact, high-density FPGA module that provides a powerful and flexible solution for complex digital designs. It is designed to meet the demanding requirements of various industries, including aerospace, defense, industrial, and telecommunications.

Features:

  1. Device: Intel® Stratix® 10 GX 1150 FPGA
  2. Package: FCBGA (Fine-pitch Ball Grid Array)
  3. I/O count: 1,152
  4. Operating temperature range: Commercial (0°C to 70°C) and Industrial (-40°C to 85°C)
  5. Memory integration: Up to 28 Mbytes of MRAM (Magnetoresistive Random Access Memory)
  6. Transceivers: Support for up to 40 Gbps data rates
  7. Power management: Integrated power management and sequencing
  8. Security: Advanced security features, including encryption and secure boot
  9. Interface support: A wide range of interfaces, including PCIe, Ethernet, and DDR memory
  10. Development tools: Intel® Quartus® Prime software and other development tools for easy design and implementation

Applications:

The EP3SE260F1152C3N FPGA module is suitable for a wide range of applications due to its high performance, flexibility, and advanced features. Some potential applications include:

  1. Aerospace and defense: High-reliability systems, secure communications, and radar/sensor processing
  2. Industrial automation: Real-time control systems, motor control, and machine vision
  3. Telecommunications: Network infrastructure, 5G base stations, and optical transport
  4. Data centers: High-speed networking, storage systems, and security appliances
  5. Automotive: Advanced driver-assistance systems (ADAS), in-vehicle networking, and infotainment systems
  6. High-performance computing: Accelerators, cryptography, and data analytics

In summary, the Intel EP3SE260F1152C3N is a powerful and versatile FPGA module that offers a range of features and capabilities suitable for various industries and applications. Its high performance, advanced security features, and support for a wide range of interfaces make it an ideal choice for complex digital designs.

FAQ

What package or case is EP3SE260F1152C3N available in?
EP3SE260F1152C3N is available in the FBGA package / case.
What voltage specification is listed for EP3SE260F1152C3N?
Is EP3SE260F1152C3N currently in stock?
Are there related or alternative parts for EP3SE260F1152C3N?
What is the mounting type of EP3SE260F1152C3N?
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