Intel Tariff Inquiry

EP3SE260F1517C2N

EP3SE260F1517C2N Description

The EP3SE260F1517C2N is an IC Field Programmable Gate Array (FPGA) from Intel, featuring a robust set of technical specifications designed for high-performance applications. This FPGA is part of the Stratix® III E series, known for its advanced capabilities and reliability. It operates within a temperature range of 0°C to 85°C (TJ) and is RoHS compliant, ensuring environmental safety. The device is available in a 1517FBGA package, making it suitable for surface mount applications. It has a total of 976 I/Os, providing extensive connectivity options. The FPGA supports a supply voltage range of 0.86V to 1.15V, making it energy-efficient. With a moisture sensitivity level (MSL) of 3 (168 hours), it is well-suited for environments where moisture control is critical.

EP3SE260F1517C2N Features

The EP3SE260F1517C2N boasts a significant number of Logic Elements/Cells, totaling 255,000, which allows for complex and high-density designs. It also features 10,200 Logic Array Blocks (LABs) or Configurable Logic Blocks (CLBs), enhancing its flexibility and adaptability for various applications. The FPGA is equipped with a substantial amount of RAM, with 16,672,768 total RAM bits, enabling efficient data handling and processing. The device is designed for surface mount technology, ensuring ease of integration into modern PCB designs. Although the product status is marked as obsolete, it remains a reliable choice for legacy systems and specific applications where its unique features are required.

EP3SE260F1517C2N Applications

The EP3SE260F1517C2N is ideal for applications requiring high-density logic and extensive I/O capabilities. It is particularly well-suited for complex digital signal processing (DSP) tasks, communication systems, and high-speed data processing. Its large number of I/Os and logic elements make it a powerful tool for designing advanced control systems, embedded systems, and high-performance computing applications. The FPGA's wide operating temperature range and RoHS compliance make it suitable for industrial and automotive environments where reliability and environmental standards are paramount. Additionally, its surface mount package and moisture sensitivity level ensure it can be effectively integrated into modern manufacturing processes.

Conclusion of EP3SE260F1517C2N

The EP3SE260F1517C2N FPGA from Intel offers a comprehensive set of features that make it a powerful solution for a variety of high-performance applications. Despite its obsolete status, its robust technical specifications, including a large number of logic elements, extensive I/O capabilities, and substantial RAM, continue to make it a valuable choice for specific use cases. Its compatibility with surface mount technology and RoHS compliance further enhance its appeal for modern electronics design. For applications requiring high-density logic and reliable performance, the EP3SE260F1517C2N remains a compelling option.