Intel_EP3SE260H780C2N
original

Intel
EP3SE260H780C2N

696-EP3SE260H780C2N
PDF Datasheet
Field Programmable Gate Array, 800MHz, 255000-Cell, CMOS, PBGA780, LEAD FREE, HBGA-780

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Tech Specifications

Max Operating Temperature
85
Number of Terminals
780
Min Operating Temperature
0
Terminal Position
BOTTOM
JEDEC Package Code
S-PBGA-B780
Width
33
Length
33
Temperature Grade
OTHER
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EP3SE260H780C2N Description

The Intel EP3SE260H780C2N is a high-performance, versatile FPGA (Field-Programmable Gate Array) module designed for a wide range of applications. This module is based on the Intel Cyclone V E FPGA device, which offers a combination of low power consumption, high performance, and advanced features.

Description:

The EP3SE260H780C2N is a compact and robust module that measures 90mm x 90mm x 20mm. It features a 28-nm low-power process technology and a 2.5V I/O voltage. The module is designed to operate in a wide temperature range of -40°C to +85°C, making it suitable for various industrial and commercial applications.

Features:

  1. Intel Cyclone V E FPGA device: The module is based on the Intel Cyclone V E FPGA, which offers a high-performance, low-power solution for a wide range of applications.
  2. High I/O count: The EP3SE260H780C2N provides a large number of I/O pins, making it suitable for applications that require a high-density of I/O connections.
  3. DDR3 memory interface: The module features a DDR3 memory interface, providing high-speed data storage and retrieval capabilities.
  4. Gigabit Ethernet interface: The module includes a Gigabit Ethernet interface, enabling high-speed data communication and networking capabilities.
  5. USB interface: The module provides a USB interface for easy connectivity with other devices and peripherals.
  6. Power management: The EP3SE260H780C2N offers advanced power management features, ensuring efficient power usage and reducing overall power consumption.
  7. Industrial temperature range: The module is designed to operate in a wide temperature range, making it suitable for various industrial and commercial applications.

Applications:

The Intel EP3SE260H780C2N FPGA module is suitable for a wide range of applications, including but not limited to:

  1. Industrial automation and control systems: The module's high I/O count and robust design make it ideal for use in industrial automation and control systems.
  2. Networking and communication: The Gigabit Ethernet and USB interfaces make the module suitable for networking and communication applications.
  3. Data storage and retrieval: The DDR3 memory interface provides high-speed data storage and retrieval capabilities, making the module suitable for applications that require fast access to large amounts of data.
  4. Signal processing: The high-performance FPGA device and advanced features make the module ideal for signal processing applications, such as image and video processing, audio processing, and data acquisition.
  5. Embedded systems: The compact size and low power consumption of the module make it suitable for use in embedded systems, where space and power efficiency are critical.
  6. Research and development: The versatility and advanced features of the EP3SE260H780C2N make it an excellent choice for research and development projects in various fields, including aerospace, defense, and telecommunications.

In summary, the Intel EP3SE260H780C2N is a high-performance, versatile FPGA module that offers a range of advanced features and capabilities. Its compact size, robust design, and wide temperature range make it suitable for a variety of applications in industries such as industrial automation, networking, communication, data storage, signal processing, embedded systems, and research and development.

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