Intel_EP3SL200F1517C4
original

Intel
EP3SL200F1517C4

696-EP3SL200F1517C4
PDF Datasheet
Field Programmable Gate Array, 717MHz, 200000-Cell, CMOS, PBGA1517, FBGA-1517

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Tech Specifications

Max Operating Temperature
85
Number of Terminals
1517
Min Operating Temperature
0
Terminal Position
BOTTOM
JEDEC Package Code
S-PBGA-B1517
Width
40
Length
40
Temperature Grade
OTHER
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EP3SL200F1517C4 Description

The Intel EP3SL200F1517C4 is a high-performance FPGA (Field-Programmable Gate Array) module designed for a wide range of applications, including industrial control, automotive, and communication systems. This module is based on the Intel Cyclone III FPGA device and offers a combination of features and capabilities that make it suitable for various applications.

Description:

The Intel EP3SL200F1517C4 is a compact and versatile FPGA module that provides a high level of integration and performance. It features a 200-pin FBGA package and is designed to operate in a wide temperature range of -40°C to +125°C, making it suitable for harsh environments. The module is equipped with a comprehensive set of I/O interfaces, including LVCMOS, LVDS, and TTL, to support various communication protocols and data transfer rates.

Features:

  1. Intel Cyclone III FPGA device at the core, offering high performance and low power consumption.
  2. 200-pin FBGA package for compact and efficient design.
  3. Wide operating temperature range of -40°C to +125°C, suitable for harsh environments.
  4. Rich set of I/O interfaces, including LVCMOS, LVDS, and TTL, for flexible communication options.
  5. On-board power management and clock management circuits for stable and reliable operation.
  6. Configurable logic resources, including digital signal processing blocks and memory elements, for customizing the module to specific application requirements.
  7. Support for various industry-standard communication protocols, such as Ethernet, USB, and PCI Express.

Applications:

  1. Industrial control systems: The EP3SL200F1517C4 can be used in industrial control applications, such as motor control, machine vision, and process automation, due to its high performance, reliability, and flexibility.
  2. Automotive systems: The module's wide temperature range and robust design make it suitable for automotive applications, such as infotainment systems, advanced driver assistance systems (ADAS), and in-vehicle networking.
  3. Communication systems: The EP3SL200F1517C4 can be employed in communication systems, such as base stations, routers, and switches, to provide high-speed data processing and flexible protocol support.
  4. Embedded computing: The module's configurable logic resources and support for various communication protocols make it an ideal choice for embedded computing applications, such as edge computing devices and IoT gateways.
  5. Aerospace and defense: The EP3SL200F1517C4's ability to operate in harsh environments and its high level of integration make it suitable for aerospace and defense applications, such as avionics systems and military communication equipment.

In summary, the Intel EP3SL200F1517C4 is a versatile and high-performance FPGA module that offers a wide range of features and capabilities, making it suitable for various applications across different industries. Its compact design, robust performance, and flexible communication options make it an attractive choice for engineers and system designers looking for a reliable and customizable solution.

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