Intel_EP3SL200F1517I3NAA
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Intel
EP3SL200F1517I3NAA

696-EP3SL200F1517I3NAA
PDF Datasheet
IC FPGA 976 I/O 1517FBGA

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Tech Specifications

Operating Temperature
-40°C ~ 100°C (TJ)
Total RAM Bits
10901504
Number of LABs/CLBs
80000
ECCN
OBSOLETE
Number of I/O
976
Mounting Type
Surface Mount
Product Status
Obsolete
Supplier Device Package
1517-FBGA (40x40)
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EP3SL200F1517I3NAA Description

The Intel EP3SL200F1517I3NAA is a high-performance programmable logic device from Intel's Cyclone V family. This device is designed to provide a combination of high-density logic integration, low power consumption, and high-speed performance, making it an ideal solution for a wide range of applications.

Description:

The EP3SL200F1517I3NAA is a field programmable gate array (FPGA) that is based on Intel's 28-nm low-power process technology. It features a high-density architecture with up to 200,000 logic elements and 552 digital signal processing (DSP) blocks, making it suitable for complex digital signal processing and high-speed data processing applications.

Features:

Some of the key features of the EP3SL200F1517I3NAA include:

  1. High-density architecture: The device offers a high-density architecture with up to 200,000 logic elements and 552 DSP blocks, providing a high level of integration and flexibility for complex designs.
  2. Low power consumption: The device is designed to operate at low power levels, making it suitable for battery-powered and energy-sensitive applications.
  3. High-speed performance: The device offers high-speed performance with a maximum operating frequency of up to 400 MHz, making it suitable for high-speed data processing and communication applications.
  4. Advanced I/O capabilities: The device features a wide range of I/O capabilities, including high-speed transceivers, multi-gigabit transceivers, and versatile I/O functions, making it suitable for a wide range of interface and communication applications.
  5. Security features: The device includes advanced security features, such as encryption and authentication, to protect sensitive data and intellectual property.

Applications:

The EP3SL200F1517I3NAA is suitable for a wide range of applications, including:

  1. Digital signal processing: The high-density architecture and DSP blocks make the device well-suited for complex digital signal processing applications, such as audio and video processing, image and video compression, and communication systems.
  2. High-speed data processing: The high-speed performance and advanced I/O capabilities make the device suitable for high-speed data processing and communication applications, such as network infrastructure, storage systems, and data centers.
  3. Industrial control systems: The device's low power consumption and advanced I/O capabilities make it suitable for industrial control systems, such as motor control, robotics, and automation systems.
  4. Security applications: The advanced security features of the device make it suitable for security applications, such as encryption, authentication, and secure communication systems.
  5. Aerospace and defense: The device's high reliability and radiation tolerance make it suitable for aerospace and defense applications, such as satellite communication systems, radar systems, and electronic warfare systems.

In summary, the Intel EP3SL200F1517I3NAA is a high-performance FPGA that offers a combination of high-density logic integration, low power consumption, and high-speed performance. Its advanced features and capabilities make it suitable for a wide range of applications, including digital signal processing, high-speed data processing, industrial control systems, security applications, and aerospace and defense.

FAQ

What package or case is EP3SL200F1517I3NAA available in?
EP3SL200F1517I3NAA is available in the 1517-BBGA, FCBGA package / case.
What is EP3SL200F1517I3NAA?
What is the mounting type of EP3SL200F1517I3NAA?
Are there related or alternative parts for EP3SL200F1517I3NAA?
Is EP3SL200F1517I3NAA currently in stock?
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