Intel_EP3SL70F484I3G
Intel_EP3SL70F484I3G
original

Intel
EP3SL70F484I3G

696-EP3SL70F484I3G
PDF Datasheet
IC FPGA 296 I/O 484FBGA
26 Weeks

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Tech Specifications

Operating Temperature
-40°C ~ 100°C (TJ)
Total RAM Bits
2699264
Number of LABs/CLBs
2700
ECCN
3A001A2C
Number of I/O
296
Mounting Type
Surface Mount
Product Status
Active
Supplier Device Package
484-FBGA (23x23)
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EP3SL70F484I3G Description

EP3SL70F484I3G Description

The EP3SL70F484I3G is a high-performance Field Programmable Gate Array (FPGA) from Intel, designed for demanding embedded applications. This IC belongs to the Stratix® III L series, known for its advanced capabilities and efficiency. The EP3SL70F484I3G features a total of 2,699,264 RAM bits and 2,700 Logic Array Blocks (LABs) or Configurable Logic Blocks (CLBs), providing robust processing power. It supports a voltage supply range of 0.86V to 1.15V, making it suitable for low-power applications. With 296 I/Os, this FPGA can handle complex interfacing tasks. The device is packaged in a 484-pin Fine Ball Grid Array (FBGA) and is available in tray packaging. It is RoHS compliant and REACH unaffected, ensuring environmental safety. The EP3SL70F484I3G has a moisture sensitivity level (MSL) of 3, allowing for 168 hours of exposure before assembly.

EP3SL70F484I3G Features

  • High Logic Capacity: With 67,500 logic elements/cells, the EP3SL70F484I3G can implement complex digital designs efficiently.
  • Low Power Consumption: The voltage supply range of 0.86V to 1.15V ensures low power usage, making it ideal for power-sensitive applications.
  • Robust I/O Capability: The 296 I/Os provide extensive connectivity options, supporting various communication protocols and interfaces.
  • Advanced Packaging: The 484FBGA package offers high thermal performance and reliability, suitable for high-density applications.
  • Environmental Compliance: RoHS compliance and REACH unaffected status ensure that the device meets stringent environmental regulations.
  • Low Moisture Sensitivity: An MSL of 3 allows for extended handling times before assembly, reducing the risk of moisture-related damage.

EP3SL70F484I3G Applications

The EP3SL70F484I3G is ideal for a wide range of high-performance embedded applications, including:

  • Telecommunications: Ideal for base stations, switches, and other telecom infrastructure requiring high-speed data processing and low latency.
  • Military and Aerospace: Suitable for radar systems, avionics, and other applications demanding high reliability and performance.
  • Industrial Automation: Perfect for programmable logic controllers (PLCs), robotics, and other industrial applications requiring real-time processing and control.
  • Medical Equipment: Suitable for diagnostic imaging, patient monitoring, and other medical devices requiring high computational power and reliability.
  • Data Centers: Ideal for high-speed networking, storage, and other data center applications requiring efficient data processing and low power consumption.

Conclusion of EP3SL70F484I3G

The EP3SL70F484I3G is a versatile and high-performance FPGA from Intel, offering a combination of advanced features and environmental compliance. Its robust logic capacity, low power consumption, and extensive I/O capability make it suitable for a wide range of demanding applications. Whether used in telecommunications, military, industrial automation, medical equipment, or data centers, the EP3SL70F484I3G provides reliable and efficient performance. Its low moisture sensitivity and compliance with environmental regulations further enhance its appeal for modern electronics applications.

FAQ

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The standard lead time for EP3SL70F484I3G is 26 Weeks.
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