Intel_EPF10K30EFC256-3
original

Intel
EPF10K30EFC256-3

696-EPF10K30EFC256-3
PDF Datasheet
Loadable PLD, 0.6ns, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, FINE LINE, BGA-256

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Tech Specifications

Max Operating Temperature
70
Number of Terminals
256
Min Operating Temperature
0
Terminal Position
BOTTOM
JEDEC Package Code
S-PBGA-B256
Width
17
Length
17
Temperature Grade
COMMERCIAL
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EPF10K30EFC256-3 Description

The Intel EPF10K30EFC256-3 is a high-performance field programmable gate array (FPGA) that is part of Intel's MAX 10 family. This device is designed to provide a range of features and capabilities that make it suitable for a variety of applications, including embedded systems, IoT devices, and high-speed communication systems.

Description:

The EPF10K30EFC256-3 is a 28-nm low-power CMOS device that features a high-density architecture and a range of configurable logic blocks, memory resources, and I/O capabilities. It is available in a 256-ball fine-pitch ball grid array (FBGA) package, making it suitable for use in a wide range of applications where space is at a premium.

Features:

Some of the key features of the EPF10K30EFC256-3 include:

  1. High-density architecture: The device offers a high-density architecture that provides a large number of configurable logic blocks, memory resources, and I/O capabilities, making it suitable for complex designs.
  2. Low power consumption: The 28-nm low-power CMOS process technology used in the EPF10K30EFC256-3 helps to reduce power consumption, making it suitable for battery-powered and energy-sensitive applications.
  3. Memory resources: The device includes a range of memory resources, including block RAM, distributed RAM, and DSP RAM, providing designers with the flexibility to implement a wide range of memory-intensive applications.
  4. I/O capabilities: The EPF10K30EFC256-3 offers a wide range of I/O capabilities, including support for high-speed transceivers, multi-gigabit transceivers, and flexible I/O (FPIO) technology, making it suitable for use in a variety of communication and interface applications.
  5. Security features: The device includes a range of security features, including secure boot, encrypted bitstream storage, and user-controlled programmability, providing designers with the ability to protect their intellectual property and ensure the security of their designs.

Applications:

The Intel EPF10K30EFC256-3 is suitable for a wide range of applications, including:

  1. Embedded systems: The high-density architecture and low power consumption of the EPF10K30EFC256-3 make it well-suited for use in embedded systems, where space and power are often at a premium.
  2. IoT devices: The device's I/O capabilities and security features make it an ideal choice for IoT devices, where connectivity and security are critical.
  3. High-speed communication systems: The high-speed transceivers and multi-gigabit transceivers available in the EPF10K30EFC256-3 make it suitable for use in high-speed communication systems, such as telecom and networking equipment.
  4. Industrial control systems: The device's flexibility and configurability make it well-suited for use in industrial control systems, where a wide range of functions and interfaces may be required.
  5. Automotive systems: The EPF10K30EFC256-3's low power consumption and security features make it an attractive option for use in automotive systems, where reliability and security are critical.

In summary, the Intel EPF10K30EFC256-3 is a high-performance FPGA that offers a range of features and capabilities that make it suitable for a variety of applications, including embedded systems, IoT devices, and high-speed communication systems. Its high-density architecture, low power consumption, memory resources, I/O capabilities, and security features make it an attractive option for designers looking for a flexible and powerful solution for their projects.

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