Intel

EPM570GF256C4  

CPLDs

EPM570GF256C4 Description

The EPM570GF256C4 is a high-performance Complex Programmable Logic Device (CPLD) from Intel, designed to offer advanced functionality and flexibility in a compact 256-pin Fine Ball Grid Array (FBGA) package. This device is part of the renowned MAX® II series, known for its efficiency and reliability in various electronic applications. The EPM570GF256C4 features 440 macrocells and 570 logic elements/blocks, providing significant programmability and logic density. It supports in-system programming, allowing for easy updates and modifications without the need for additional programming hardware.

EPM570GF256C4 Features

• High Logic Density: With 440 macrocells and 570 logic elements/blocks, the EPM570GF256C4 offers substantial logic capacity, making it suitable for complex designs requiring multiple functions.
• Fast Performance: The device boasts a maximum delay time (tpd) of 5.4 ns, ensuring high-speed operation and quick response times, which are critical for real-time applications.
• Wide Operating Temperature Range: The EPM570GF256C4 operates reliably within a temperature range of 0°C to 85°C (TJ), making it suitable for a variety of industrial and commercial environments.
• Flexible Power Supply: It operates with an internal voltage supply ranging from 1.71V to 1.89V, providing flexibility in power management and compatibility with different power sources.
• Surface Mount Technology: The surface mount mounting type ensures ease of integration into modern printed circuit boards (PCBs), facilitating automated assembly processes and reducing overall board size.
• Extensive I/O Capabilities: The device includes 160 I/O pins, providing ample connectivity options for interfacing with other components and systems.
• Moisture Sensitivity Level: With an MSL of 3 (168 hours), the EPM570GF256C4 is well-suited for manufacturing processes that require extended exposure to moisture, ensuring robustness and reliability.
• Compliance and Standards: The device is REACH unaffected and classified under ECCN 3A991D and HTSUS 8542.39.0001, ensuring compliance with international regulations and standards.

EPM570GF256C4 Applications

The EPM570GF256C4 is ideal for a wide range of applications due to its high performance, flexibility, and robustness. Some specific use cases include:

• Embedded Systems: The device's high logic density and in-system programmability make it perfect for embedded systems requiring custom logic functions and rapid development cycles.
• Industrial Automation: Its wide operating temperature range and extensive I/O capabilities make it suitable for industrial control systems, where reliability and connectivity are paramount.
• Telecommunications: The EPM570GF256C4's fast performance and high logic density are beneficial for telecom applications, such as signal processing and protocol conversion.
• Consumer Electronics: The compact FBGA package and surface mount technology make it ideal for consumer electronics, where space and ease of manufacturing are critical factors.
• Automotive Electronics: The device's robustness and compliance with industry standards make it suitable for automotive applications, where reliability and performance are essential.

Conclusion of EPM570GF256C4

The EPM570GF256C4 from Intel is a versatile and high-performance CPLD that offers significant advantages over similar models. Its combination of high logic density, fast performance, and extensive I/O capabilities make it suitable for a wide range of applications, from embedded systems to industrial automation. The device's in-system programmability and surface mount technology ensure ease of integration and flexibility, while its compliance with international standards ensures reliability and compatibility. The EPM570GF256C4 is an excellent choice for designers and engineers looking for a robust, high-performance CPLD solution.

EPM570GF256C4 Documents

Download datasheets and manufacturer documentation for EPM570GF256C4

Errata :

MAX II Device Family Errata      

Datasheets :

Max II Device Order Guide      

PCN Packaging :

Mult Dev Label Chgs 24/Feb/2020       Mult Dev Label CHG 24/Jan/2020      

PCN Obsolescence/ EOL :

Mult Dev EOL 4/Dec/2020       MAX II EOL-Reversal 19/Mar/2021      

HTML Datasheet :

Max II Device Order Guide      

PCN Design/Specification :

Quartus SW/Web Chgs 23/Sep/2021       Mult PN LABEL 01/08/2023