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FW82801DB

FW82801DB Description

The FW82801DB is a high-performance I/O Controller Hub (ICH) from Intel’s 840 Series, designed for embedded and computing applications requiring robust system management. Manufactured by Intel, this surface-mount IC comes in a 421-microBGA package, ensuring compact integration in space-constrained designs. With an ECCN of EAR99 and REACH Unaffected compliance, it meets global regulatory standards. The device operates under Moisture Sensitivity Level (MSL) 1, making it suitable for extended storage and handling. Its bulk packaging facilitates high-volume production, while its active product status ensures long-term availability.

FW82801DB Features

• Intel® 840 Series Compatibility: Optimized for high-bandwidth communication with Intel chipsets.
• Surface-Mount Design: Enables seamless PCB integration in modern electronics.
• 421-MicroBGA Package: Offers high pin density and thermal efficiency for compact systems.
• Robust I/O Control: Manages peripheral interfaces, PCI bridging, and system power states efficiently.
• Extended Reliability: MSL 1 rating ensures durability in varied environmental conditions.
• Regulatory Compliance: EAR99 and REACH Unaffected status simplifies global deployment.

FW82801DB Applications

The FW82801DB excels in applications demanding high-speed data transfer and system control, including:

• Enterprise Servers: Enhances I/O throughput for storage and networking subsystems.
• Embedded Computing: Ideal for industrial PCs, automation controllers, and medical devices.
• Telecommunications: Supports high-availability systems with reliable PCI bridging.
• Legacy System Upgrades: Provides backward compatibility while modernizing I/O performance.

Conclusion of FW82801DB

The FW82801DB stands out as a versatile, high-performance controller for Intel-based systems, combining compact packaging, regulatory compliance, and robust I/O management. Its surface-mount microBGA form factor and Intel 840 Series optimization make it a preferred choice for enterprise, embedded, and telecom applications. Engineers benefit from its long-term availability and ease of integration, ensuring scalable and future-proof designs.