Intel

TE28F800C3BA90

TE82F800C3BA90 Description

The TE28F800C3BA90 is an advanced Memory IC Chip manufactured by Intel, designed to deliver high performance and reliability in various electronic applications. This IC features a memory size of 8 Mbit, organized as 512K x 16, and operates with a parallel memory interface. The TE28F800C3BA90 is part of the ETOX™ VI series, known for its robustness and efficiency in flash memory technology. The device is available in a 48TSOP package, making it suitable for surface mount applications, and it operates within a supply voltage range of 2.7V to 3.6V. With an access time of 90 ns, this IC ensures rapid data retrieval, enhancing overall system performance. The TE28F800C3BA90 is classified under HTSUS code 8542.32.0071 and has a moisture sensitivity level (MSL) of 3, allowing for 168 hours of exposure before reflow soldering.

TE28F800C3BA90 Features

• High Memory Density: The 8 Mbit memory size, organized as 512K x 16, provides substantial storage capacity in a compact form factor.
• Fast Access Time: With an access time of 90 ns, the TE28F800C3BA90 ensures quick data retrieval, making it ideal for applications requiring rapid processing.
• Flexible Voltage Range: The IC operates within a supply voltage range of 2.7V to 3.6V, offering compatibility with a wide range of power supply configurations.
• Parallel Memory Interface: The parallel interface allows for efficient data transfer and integration with existing systems.
• Surface Mount Compatibility: The 48TSOP package is designed for surface mount technology, enabling high-density board layouts and automated assembly processes.
• Robust Flash Memory Technology: As part of the ETOX™ VI series, this IC leverages advanced flash memory technology to provide reliable and durable storage solutions.
• Moisture Sensitivity Level 3: The MSL 3 rating ensures the IC can withstand up to 168 hours of exposure before reflow soldering, enhancing its reliability in various manufacturing environments.

TE28F800C3BA90 Applications

The TE28F800C3BA90 is well-suited for a variety of applications that demand high memory density and fast data access. Some specific use cases include:

• Embedded Systems: Ideal for embedded systems requiring reliable and efficient storage solutions, such as industrial controllers, automotive electronics, and IoT devices.
• Telecommunications: Suitable for telecom infrastructure where rapid data access and high memory density are crucial for maintaining smooth operations.
• Consumer Electronics: Applicable in consumer electronics like digital cameras, gaming consoles, and smart home devices, where compact and high-performance memory solutions are essential.
• Medical Devices: Reliable storage and fast data retrieval make this IC suitable for medical devices that require accurate and timely data processing.

Conclusion of TE28F800C3BA90

The TE28F800C3BA90 stands out as a high-performance Memory IC Chip, offering a combination of high memory density, fast access time, and flexible voltage range. Its robust flash memory technology and surface mount compatibility make it a versatile choice for a wide range of applications. Whether used in embedded systems, telecommunications, consumer electronics, or medical devices, the TE28F800C3BA90 ensures reliable and efficient performance. Its unique features and advantages over similar models make it a preferred choice for engineers and designers seeking a reliable and efficient memory solution.