Macronix

MX29GL128FUT2I-90G

MX29GL128FUT2I-90G Description

The MX29GL128FUT2I-90G is a high-performance, 128 Mbit flash memory IC designed for a wide range of applications requiring reliable and efficient data storage. Manufactured by Macronix, this memory IC chip is part of the MX29GL series and features a parallel memory interface, providing fast and efficient data access. The device is organized as 16M x 8, offering a memory size of 128 Mbit with an access time of 90 nanoseconds. It operates within a supply voltage range of 2.7V to 3.6V, ensuring compatibility with various power supply systems.

The MX29GL128FUT2I-90G is packaged in a 56 TSOP (Thin Small Outline Package) and is suitable for surface mount applications. It has a moisture sensitivity level (MSL) of 3, allowing for a 168-hour exposure to standard factory environments. The product is REACH unaffected and RoHS3 compliant, ensuring it meets the highest environmental and safety standards. The memory format is FLASH, providing non-volatile storage that retains data even when power is removed.

MX29GL128FUT2I-90G Features

• Memory Organization: The MX29GL128FUT2I-90G is organized as 16M x 8, offering a total memory size of 128 Mbit. This configuration provides a balance between memory capacity and data bus width, making it suitable for applications requiring significant data storage and fast access times.
• Access Time: With an access time of 90 nanoseconds, the MX29GL128FUT2I-90G ensures rapid data retrieval, enhancing overall system performance. This fast access time is crucial for applications that require quick and efficient data processing.
• Write Cycle Time: The write cycle time for both word and page operations is 90 nanoseconds, ensuring that data can be written to the memory quickly and efficiently. This feature is particularly beneficial for applications that involve frequent data updates.
• Voltage Range: The device operates within a supply voltage range of 2.7V to 3.6V, providing flexibility in power supply design. This wide voltage range ensures compatibility with various power systems, making the MX29GL128FUT2I-90G suitable for a broad range of applications.
• Package Type: The 56 TSOP package is designed for surface mount applications, offering a compact and reliable solution for modern electronic systems. The surface mount technology (SMT) ensures ease of installation and high reliability.
• Environmental Compliance: The MX29GL128FUT2I-90G is REACH unaffected and RoHS3 compliant, ensuring it meets the highest environmental and safety standards. This compliance is essential for applications in industries with strict regulatory requirements.
• Moisture Sensitivity Level: With an MSL of 3 (168 hours), the device can withstand exposure to standard factory environments, ensuring reliability and longevity in various manufacturing conditions.

MX29GL128FUT2I-90G Applications

The MX29GL128FUT2I-90G is ideal for applications that require high-speed, non-volatile memory storage. Some specific use cases include:

• Embedded Systems: The fast access time and write cycle time make the MX29GL128FUT2I-90G suitable for embedded systems where quick data retrieval and updates are critical. This includes applications in automotive, industrial control, and consumer electronics.
• Networking Equipment: The device's high memory capacity and fast access times are beneficial for networking equipment that requires reliable and efficient data storage, such as routers and switches.
• Telecommunications: The MX29GL128FUT2I-90G can be used in telecommunications infrastructure for storing firmware and configuration data, ensuring quick and reliable access to critical information.
• Consumer Electronics: The compact 56 TSOP package and surface mount technology make the device suitable for consumer electronics where space is a premium, such as smartphones, tablets, and digital cameras.

Conclusion of MX29GL128FUT2I-90G

The MX29GL128FUT2I-90G is a high-performance flash memory IC that offers a combination of fast access times, efficient write cycles, and a wide voltage range. Its compact 56 TSOP package and surface mount technology make it suitable for a variety of applications, from embedded systems to consumer electronics. The device's environmental compliance and reliability ensure it meets the highest industry standards. While the product is marked as "Not For New Designs," its technical specifications and performance benefits make it a valuable component for existing systems and legacy applications.