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MX30LF4G18AC-TI(TRAY)
774-MX30LF4G18AC-TI(TRAY)
PDF Datasheet
SLC NAND Flash Parallel 3V/3.3V 4G-bit 512M x 8 25ns 48-Pin TSOP-I
10 weeks
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Tech Specifications
EU RoHS
Compliant
ECCN (US)
3A991b.1.a.
Part Status
Active
Automotive
No
PPAP
No
Cell Type
SLC NAND
Chip Density (bit)
4G
Architecture
Sectored
MX30LF4G18AC-TI(TRAY) Description
SLC NAND Flash Parallel 3V/3.3V 4G-bit 512M x 8 25ns 48-Pin TSOP-I
FAQ
Is MX30LF4G18AC-TI(TRAY) currently in stock?
Yes. MX30LF4G18AC-TI(TRAY) currently shows 768 unit(s) in stock.
What is the mounting type of MX30LF4G18AC-TI(TRAY)?
What operating temperature range does MX30LF4G18AC-TI(TRAY) support?
What is the standard lead time for MX30LF4G18AC-TI(TRAY)?
What package or case is MX30LF4G18AC-TI(TRAY) available in?
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