Microchip Technology_A3P1000-FGG256

Microchip Technology
A3P1000-FGG256  
FPGAs

A3P1000-FGG256
696-A3P1000-FGG256
Ersa
Microchip Technology-A3P1000-FGG256-datasheets-3637561.pdf
IC FPGA 177 I/O 256FBGA
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A3P1000-FGG256 Description

A3P1000-FGG256 Description

The A3P1000-FGG256 is a high-performance Field Programmable Gate Array (FPGA) from Microchip Technology, designed for a wide range of embedded applications. This device belongs to the ProASIC3 series and offers a robust set of features tailored for complex digital designs. The A3P1000-FGG256 is packaged in a 256-ball Fine Ball Grid Array (FBGA) and is suitable for surface-mount applications. It operates within a temperature range of 0°C to 85°C (TJ) and supports a supply voltage between 1.425V and 1.575V. With 177 I/Os, this FPGA provides extensive connectivity options for various peripheral devices.

A3P1000-FGG256 Features

  • High Gate Density: The A3P1000-FGG256 features a substantial gate count of 1,000,000 gates, enabling the implementation of complex logic designs and large-scale digital systems.
  • Substantial RAM: Equipped with 147,456 total RAM bits, this FPGA offers ample memory resources for data storage and processing, making it suitable for applications requiring significant data handling.
  • Robust I/O Capability: With 177 I/Os, the AP31000-FGG256 provides extensive connectivity options, facilitating seamless integration with various peripherals and external devices.
  • Surface-Mount Compatibility: The surface-mount mounting type ensures ease of integration into modern PCB designs, promoting compact and efficient system layouts.
  • Wide Operating Temperature Range: The operating temperature range of 0°C to 85°C (TJ) makes this FPGA suitable for a variety of industrial and commercial applications with varying environmental conditions.
  • Compliance and Standards: The A3P1000-FGG256 is REACH unaffected and ROHS3 compliant, ensuring it meets stringent environmental and safety standards. It also adheres to the HTSUS code 8542.39.0001, facilitating international trade and regulatory compliance.
  • Moisture Sensitivity Level: With an MSL rating of 3 (168 hours), the A3P1000-FGG256 is designed to withstand typical manufacturing environments, reducing the risk of moisture-related damage during assembly processes.

A3P1000-FGG256 Applications

The A3P1000-FGG256 is ideal for a variety of applications due to its high gate density, extensive I/O capability, and robust memory resources. Some specific use cases include:

  • Telecommunications: Ideal for implementing complex signal processing algorithms and control logic in communication systems, such as base stations and network routers.
  • Industrial Automation: Suitable for controlling and monitoring industrial processes, where the FPGA can manage multiple I/Os and perform real-time data processing.
  • Consumer Electronics: Used in high-end consumer devices that require significant processing power and memory, such as smart TVs, gaming consoles, and advanced multimedia systems.
  • Automotive: Employed in advanced driver-assistance systems (ADAS) and infotainment systems, where the FPGA can handle real-time data processing and control tasks.
  • Medical Devices: Used in medical imaging and diagnostic equipment, where the FPGA can process large amounts of data quickly and accurately.

Conclusion of A3P1000-FGG256

The A3P1000-FGG256 from Microchip Technology is a versatile and powerful FPGA that offers a high gate density, substantial RAM, and extensive I/O capabilities. Its surface-mount compatibility, wide operating temperature range, and compliance with environmental and safety standards make it a reliable choice for a variety of embedded applications. Whether used in telecommunications, industrial automation, consumer electronics, automotive systems, or medical devices, the A3P1000-FGG256 provides the performance and flexibility needed to meet the demands of modern digital systems.

Tech Specifications

Program Memory Type
PPAP
Product Status
Automotive
Total Number of Block RAM
Tradename
Supplier Package
Number of I/O Banks
Package / Case
Voltage - Supply
REACH Status
Family Name
Maximum Operating Supply Voltage (V)
EU RoHS
Moisture Sensitivity Level (MSL)
Operating Temperature
Total RAM Bits
Number of Inter Dielectric Layers
ECCN
JTAG Support
Supplier Temperature Grade
Mounting Type
In-System Programmability
Device System Gates
Standard Package Name
Pin Count
Reprogrammability Support
Mounting
Lead Shape
Number of Gates
Copy Protection
HTSUS
Package
Speed Grade
Number of Registers
User I/Os
Programmability
PCB changed
HTS
ECCN (US)
Number of Global Clocks
Supplier Device Package
Operating Supply Voltage (V)
Minimum Operating Temperature (°C)
Maximum Operating Temperature (°C)
Maximum I/O Performance
Process Technology
Single-Ended I/O Standards
Package Height
Mfr
Device Logic Gates
I/O Voltage (V)
RoHS Status
Device Number of DLLs/PLLs
Maximum Differential I/O Pairs
Number of I/O
Embedded Memory (Kbit)
Package Length
Maximum Supply Current (mA)
Series
Part Status
Opr. Frequency (MHz)
Package Width
Base Product Number
Minimum Operating Supply Voltage (V)
Number of Logic Array Blocks - LABs
Total Memory
RoHS
Supply Voltage - Min
Operating Supply Current
Height
Maximum Operating Temperature
Supply Voltage - Max
Width
Mounting Style
Number of Logic Elements
Embedded Memory
Minimum Operating Temperature
Moisture Sensitive
Length
Operating Supply Voltage
Number of I/Os
Maximum Operating Frequency
USHTS

A3P1000-FGG256 Documents

Download datasheets and manufacturer documentation for A3P1000-FGG256

Ersa Assembly Site 15/Feb/2022      
Ersa ProASIC3 Flash Datasheet      
Ersa Logistics 16/Nov/2016      
Ersa Software 19/Apr/2023      
Ersa ProASIC3 Flash Datasheet      
Ersa Software 19/Apr/2023       Software 20/Apr/2023      
Ersa Microchip CA Prop65       Microchip RoHS       Microchip REACH      

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