Microchip Technology_A3P250-2VQ100
original

Microchip Technology
A3P250-2VQ100

696-A3P250-2VQ100
PDF Datasheet
IC FPGA 68 I/O 100VQFP
10 Weeks

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Tech Specifications

Operating Temperature
0°C ~ 85°C (TJ)
Total RAM Bits
36864
ECCN
3A991D
Number of I/O
68
Mounting Type
Surface Mount
Product Status
Active
Supplier Device Package
100-VQFP (14x14)
Series
ProASIC3
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A3P250-2VQ100 Description

Microchip Technology's A3P250-2VQ100 is a high-performance, low-power, and highly integrated System-in-Package (SiP) solution designed for a wide range of applications. This compact and versatile device combines multiple components, such as microcontrollers, memory, and other peripherals, into a single package, making it an ideal choice for space-constrained and power-sensitive systems.

Description:

The A3P250-2VQ100 is a System-in-Package (SiP) device that integrates a microcontroller, memory, and various peripherals into a single compact package. It is designed to provide high performance, low power consumption, and a small form factor, making it suitable for a wide range of applications.

Features:

  1. High-performance microcontroller: The A3P250-2VQ100 features a high-performance microcontroller with advanced processing capabilities, allowing for efficient execution of complex tasks and algorithms.
  2. Low power consumption: The device is designed to operate with low power consumption, making it ideal for battery-powered and energy-sensitive applications.
  3. Integrated memory: The SiP includes integrated memory, such as Flash and RAM, providing ample storage for program code and data.
  4. Peripherals: The A3P250-2VQ100 comes with a range of integrated peripherals, such as communication interfaces (e.g., UART, SPI, I2C), timers, and analog-to-digital converters (ADCs), enabling seamless connectivity and data processing.
  5. Small form factor: The compact package size of the A3P250-2VQ100 makes it suitable for space-constrained applications, where minimizing the footprint is crucial.
  6. High reliability: The device is designed to meet stringent quality and reliability standards, ensuring dependable operation in various environments.

Applications:

The A3P250-2VQ100's versatility and advanced features make it suitable for a wide range of applications, including:

  1. Industrial automation: The device can be used in industrial control systems, such as motor control, sensor interfacing, and data acquisition systems.
  2. Consumer electronics: The A3P250-2VQ100 can be employed in various consumer electronics, such as smart home devices, wearables, and portable gadgets.
  3. Medical devices: The compact size and low power consumption of the SiP make it suitable for battery-operated medical devices, such as monitoring systems and diagnostic tools.
  4. Automotive: The A3P250-2VQ100 can be used in automotive applications, such as infotainment systems, telematics, and advanced driver-assistance systems (ADAS).
  5. IoT devices: The device's connectivity options and low power consumption make it an excellent choice for Internet of Things (IoT) devices, such as sensors, actuators, and communication nodes.
  6. Wireless communication: The A3P250-2VQ100 can be used in wireless communication systems, such as Zigbee, Bluetooth, and Wi-Fi modules, for data transmission and reception.

In summary, Microchip Technology's A3P250-2VQ100 is a powerful, low-power, and highly integrated System-in-Package solution that offers a wide range of features and applications. Its compact form factor, advanced microcontroller, integrated memory, and peripherals make it an ideal choice for various industries and applications where performance, power efficiency, and space constraints are critical factors.

FAQ

What package or case is A3P250-2VQ100 available in?
A3P250-2VQ100 is available in the 100-TQFP package / case.
What voltage specification is listed for A3P250-2VQ100?
What is the standard lead time for A3P250-2VQ100?
Does A3P250-2VQ100 have quantity-based pricing?
What is the mounting type of A3P250-2VQ100?
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