Microchip Technology_A3P400-2FG256
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Microchip Technology
A3P400-2FG256

696-A3P400-2FG256
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IC FPGA 178 I/O 256FBGA
8 Weeks

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Tech Specifications

Operating Temperature
0°C ~ 85°C (TJ)
Total RAM Bits
55296
ECCN
3A991D
Number of I/O
178
Mounting Type
Surface Mount
Product Status
Active
Supplier Device Package
256-FPBGA (17x17)
Series
ProASIC3
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A3P400-2FG256 Description

The A3P400-2FG256 is a high-performance, low-power, and high-density memory device manufactured by Microchip Technology. This memory device is designed to meet the demands of various applications that require high-speed data access, low power consumption, and high reliability.

Description:

The A3P400-2FG256 is a 256-megabit (Mb) synchronous dynamic random access memory (SDRAM) module, organized as 2 Gb, with a data width of 4 bits. It operates at a clock frequency of 400 MHz and has a double data rate type 2 (DDR2) interface. This memory module is available in a 256-ball fine-pitch ball grid array (FBGA) package.

Features:

  1. High-speed operation: With a clock frequency of 400 MHz and a DDR2 interface, the A3P400-2FG256 provides high-speed data access and improved performance.
  2. Low power consumption: The memory module is designed to operate at low voltage levels, reducing power consumption and heat generation.
  3. High-density storage: The A3P400-2FG256 offers 256-megabit storage capacity, making it suitable for applications that require large amounts of data storage.
  4. Error-correcting code (ECC) support: The memory module supports error-correcting code, which helps in detecting and correcting data corruption, ensuring data integrity.
  5. Built-in self-test (BIST): The A3P400-2FG256 has a built-in self-test feature that allows for easy diagnostics and troubleshooting.
  6. Enhanced reliability: The memory module is designed to withstand harsh environmental conditions and provide reliable performance over time.

Applications:

The A3P400-2FG256 memory module is suitable for a wide range of applications that require high-speed data access, low power consumption, and high reliability. Some of the potential applications include:

  1. Networking equipment: Routers, switches, and other networking devices that require high-speed data processing and storage.
  2. Embedded systems: Industrial control systems, medical devices, and other embedded systems that demand reliable and efficient memory solutions.
  3. Consumer electronics: High-end smartphones, tablets, and other consumer electronics that require large amounts of data storage and fast data access.
  4. Automotive systems: In-vehicle infotainment systems, advanced driver-assistance systems (ADAS), and other automotive applications that require high-speed data processing and storage.
  5. Aerospace and defense: Military and aerospace applications that demand high-reliability memory solutions for data storage and processing.

In summary, the A3P400-2FG256 is a high-performance, low-power, and high-density memory module designed for various applications that require fast data access, low power consumption, and high reliability. Its features, such as high-speed operation, ECC support, and built-in self-test, make it an ideal choice for a wide range of applications in networking, embedded systems, consumer electronics, automotive, and aerospace and defense industries.

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