Microchip Technology_ATPL230AG55J19-Y
Microchip Technology_ATPL230AG55J19-Y
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Microchip Technology
ATPL230AG55J19-Y

769-ATPL230AG55J19-Y
PDF Datasheet
PL230A-AKU-Y SAMG55J19A-MU LQFP

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Tech Specifications

Core Processor
External
Operating Temperature
-40°C ~ 85°C
Program Memory Type
-
Applications
Power Line Communications
RAM Size
-
ECCN
5A002A1
Mounting Type
Surface Mount
Product Status
Active
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ATPL230AG55J19-Y Description

ATPL230AG55J19-Y Description

The ATPL230AG55J19-Y is a high-performance Application Specific Microcontroller (MCU) designed by Microchip Technology, tailored for Power Line Communications (PLC) applications. This MCU is part of the ATPL230 series and leverages the robust capabilities of the SAMG55J19A-MU LQFP platform. It features a surface mount package, ensuring ease of integration into compact and space-constrained designs. The device operates within a supply voltage range of 3V to 3.6V, making it suitable for low-power applications. With a Moisture Sensitivity Level (MSL) of 3 (168 Hours), it is well-suited for environments where moisture resistance is critical. The ATPL230AG55J19-Y is packaged in a tray, facilitating efficient handling and storage during manufacturing processes.

ATPL230AG55J19-Y Features

  • Core Processor: The ATPL230AG55J19-Y utilizes an external core processor, allowing for flexibility in system design and integration with various external processing units.
  • Programming Verification: While DigiKey programmability has not been verified, the device is fully programmable, offering extensive customization options for specific application requirements.
  • Interface: The MCU supports SPI interface, enabling seamless communication with other devices and peripherals, enhancing the overall system connectivity and data transfer capabilities.
  • Power Supply: The voltage range of 3V to 3.6V ensures efficient power usage and compatibility with a wide range of power sources, making it ideal for battery-operated or low-power PLC applications.
  • Compliance and Standards: The ATPL230AG55J19-Y is REACH unaffected and ROHS3 compliant, adhering to stringent environmental and safety regulations, ensuring its suitability for global markets.
  • Customization and Integration: The base product number ATPL230 indicates its compatibility with other products in the series, facilitating scalable and modular system designs.

ATPL230AG55J19-Y Applications

The ATPL230AG55J19-Y is specifically designed for Power Line Communications, making it ideal for applications where data transmission over existing electrical infrastructure is required. Its low-power operation and robust performance make it suitable for:

  • Smart Grids: Enhancing communication and control in electrical power distribution networks.
  • Home Automation: Enabling communication between smart devices and control systems over existing power lines.
  • Industrial Automation: Facilitating data transmission and control in industrial environments where PLC is essential.
  • Remote Monitoring Systems: Providing reliable communication for remote monitoring and control applications.

Conclusion of ATPL230AG55J19-Y

The ATPL230AG55J19-Y stands out as a versatile and efficient Application Specific MCU, particularly suited for Power Line Communications. Its surface mount package, low-power operation, and robust communication capabilities make it an ideal choice for a variety of applications, from smart grids to home automation. The device's compliance with environmental and safety standards further enhances its marketability and usability. With its unique features and extensive customization options, the ATPL230AG55J19-Y offers significant advantages over similar models, making it a valuable component in modern PLC systems.

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