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KSZ8382Q

KSZ8382Q Description

The KSZ8382Q from Microchip Technology is a high-performance Telecom Interface IC designed for advanced communication systems. Packaged in a 128-QFP (Quad Flat Package) and delivered in a tray, this surface-mount device is RoHS3 compliant and adheres to REACH Unaffected standards. With an ECCN 5A991B1 classification and HTSUS 8542.39.0001, it meets stringent regulatory requirements. The IC operates as a telecom circuit with an LCD interface, offering robust connectivity and signal integrity. Its Moisture Sensitivity Level (MSL) 3 (168 Hours) ensures reliability in humid environments, making it suitable for industrial and telecom applications.

KSZ8382Q Features

• High-Speed Interface: Optimized for telecom systems with low-latency data transmission.
• Robust Packaging: 128-QFP ensures durability and efficient heat dissipation.
• Regulatory Compliance: Meets RoHS3, REACH, and ECCN 5A991B1 standards.
• Extended MSL Rating: MSL 3 (168 Hours) for enhanced moisture resistance.
• Surface-Mount Design: Facilitates compact PCB integration in space-constrained applications.
• Base Product Number KSZ8382: Ensures compatibility with related Microchip products.

KSZ8382Q Applications

• Telecommunication Infrastructure: Ideal for switches, routers, and base stations requiring high-speed data handling.
• Industrial Networking: Suitable for rugged environments due to its robust construction and moisture resistance.
• LCD-Based Systems: Optimized for devices integrating LCD interfaces, such as diagnostic equipment or control panels.
• Data Centers: Enhances signal integrity in high-density networking hardware.

Conclusion of KSZ8382Q

The KSZ8382Q stands out as a high-reliability telecom IC with superior performance, compliance, and integration capabilities. Its 128-QFP packaging, LCD interface, and extended MSL rating make it a preferred choice for demanding applications in telecom, industrial, and data center environments. Microchip’s commitment to quality ensures this IC delivers consistent performance, making it a dependable solution for next-generation communication systems.