Microchip Technology Tariff Inquiry

LE57D111BTC

LE57D111BTC Description

The LE57D111BTC is a highly specialized Interface IC Chip designed by Microchip Technology, catering specifically to the telecommunications industry. This chip is engineered to provide robust and efficient Subscriber Line Interface Concept (SLIC) functionality, making it an essential component for telecommunication systems. The LE57D111BTC is housed in a 44-pin TQFP package, ensuring compactness and ease of integration into various electronic designs.

LE57D111BTC Features

• ECCN Classification: The LE57D111BTC is classified under ECCN EAR99, indicating its general availability without specific export restrictions.
• Mounting Type: Designed for Surface Mount technology, this chip is ideal for modern PCB designs that require compact and reliable components.
• Supply Current: With a supply current of 9mA, the LE57D111BTC ensures minimal power consumption, making it suitable for energy-efficient applications.
• Voltage Range: The chip operates within a supply voltage range of 4.75V to 5.25V, providing flexibility and compatibility with a wide range of power supplies.
• Circuit Count: The LE57D111BTC features two circuits, enabling simultaneous handling of multiple subscriber lines, thereby enhancing the efficiency of telecommunication systems.
• Compliance and Standards: The chip is REACH Unaffected and ROHS3 Compliant, ensuring it meets the highest environmental and safety standards. It also adheres to the HTSUS code 8542.39.0001.
• Moisture Sensitivity Level (MSL): With an MSL of 3 (168 Hours), the LE57D111BTC is designed to withstand typical manufacturing environments, reducing the risk of moisture-related failures.
• Packaging: The chip is packaged in trays, facilitating easy handling and storage during manufacturing processes.

LE57D111BTC Applications

The LE57D111BTC is particularly well-suited for applications requiring efficient and reliable telecommunication interfaces. Its SLIC functionality makes it ideal for:

• Telecommunication Equipment: Enhancing the performance of telephone exchanges, PBX systems, and other telecommunication infrastructure.
• Voice Over IP (VoIP) Systems: Providing high-quality voice transmission in VoIP applications, ensuring clear and reliable communication.
• Multi-line Telephones: Enabling the simultaneous handling of multiple subscriber lines in multi-line telephones, improving overall system efficiency.
• Telecom Modems and Routers: Enhancing the functionality of telecom modems and routers by providing robust SLIC capabilities.

Conclusion of LE57D111BTC

The LE57D111BTC from Microchip Technology stands out as a reliable and efficient solution for telecommunication interface applications. Its low power consumption, wide voltage range, and dual-circuit design offer significant advantages over similar models. The chip's compliance with environmental and safety standards further enhances its appeal for modern electronic designs. Despite its obsolete status, the LE57D111BTC remains a valuable component for applications requiring robust SLIC functionality. Its compact 44TQFP package and surface mount technology make it an ideal choice for designers seeking to integrate high-performance telecommunication interfaces into their systems.